Datasheet 搜索 > 传感器 > Melexis > MLX90316KDC-BDG-100-RE 数据手册 > MLX90316KDC-BDG-100-RE 数据手册 6/45 页
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MLX90316KDC-BDG-100-RE 数据手册 - Melexis
制造商:
Melexis
分类:
传感器
封装:
SOIC-8
描述:
MLX90316 系列 360 °/s 4.5 至 5.5 V 表面贴装 旋转 位置传感器 IC - SOIC-8
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MLX90316KDC-BDG-100-RE数据手册
Page:
of 45 Go
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MLX90316
Rotary Position Sensor IC
3901090316
Page 6 of 45 Jul/13
Rev10
15.
MLX90316 SELF DIAGNOSTIC .......................................................................................................... 28
16.
SERIAL PROTOCOL ........................................................................................................................... 30
16.1.
I
NTRODUCTION
......................................................................................................................................... 30
16.2.
SERIAL
PROTOCOL
M
ODE
................................................................................................................... 30
16.3.
MOSI
(M
ASTER
O
UT
S
LAVE
I
N
) ............................................................................................................... 30
16.4.
MISO
(M
ASTER
I
N
S
LAVE
O
UT
) ............................................................................................................... 30
16.5.
SS
(S
LAVE
S
ELECT
) .................................................................................................................................. 30
16.6.
M
ASTER
S
TART
-U
P
................................................................................................................................... 30
16.7.
S
LAVE
S
TART
-U
P
...................................................................................................................................... 30
16.8.
T
IMING
...................................................................................................................................................... 31
16.9.
S
LAVE
R
ESET
............................................................................................................................................ 32
16.10.
F
RAME
L
AYER
.......................................................................................................................................... 32
16.10.1.
Command Device Mechanism .......................................................................................................... 32
16.10.2.
Data Frame Structure ...................................................................................................................... 32
16.10.3.
Timing............................................................................................................................................... 32
16.10.4.
Data Structure .................................................................................................................................. 33
16.10.5.
Angle Calculation ............................................................................................................................. 33
16.10.6.
Error Handling ................................................................................................................................. 33
17.
RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 34
17.1.
A
NALOG
O
UTPUT
W
IRING WITH THE
MLX90316
IN
SOIC
P
ACKAGE
....................................................... 34
17.2.
A
NALOG
O
UTPUT
W
IRING WITH THE
MLX90316
IN
TSSOP
P
ACKAGE
.................................................... 35
17.3.
PWM
L
OW
S
IDE
O
UTPUT
W
IRING
............................................................................................................ 35
17.4.
S
ERIAL
P
ROTOCOL
.................................................................................................................................... 36
17.4.1.
SPI Version – Single Die ...................................................................................................................... 36
17.4.2.
SPI Version – Dual Die ........................................................................................................................ 37
17.4.3.
Non SPI Version (Standard Version).................................................................................................... 38
18.
STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 39
19.
ESD PRECAUTIONS ........................................................................................................................... 39
20.
PACKAGE INFORMATION .................................................................................................................. 40
20.1.
SOIC8
-
P
ACKAGE
D
IMENSIONS
............................................................................................................... 40
20.2.
SOIC8
-
P
INOUT AND
M
ARKING
............................................................................................................... 40
20.3.
SOIC8
-
IMC
P
OSITIONNING
..................................................................................................................... 41
20.4.
TSSOP16
-
P
ACKAGE
D
IMENSIONS
.......................................................................................................... 42
20.5.
TSSOP16
-
P
INOUT AND
M
ARKING
.......................................................................................................... 43
20.6.
TSSOP16
-
IMC
P
OSITIONNING
................................................................................................................ 43
21.DISCLAIMER………………………………………………………………………………………………........45
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