Datasheet 搜索 > 双极性晶体管 > Fairchild（飞兆/仙童） > MMBT2907A 数据手册 > MMBT2907A 数据手册 1/21 页
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MMBT2907A 数据手册 - Fairchild（飞兆/仙童）
制造商:
Fairchild（飞兆/仙童）
分类:
双极性晶体管
封装:
SOT-23-3
描述:
FAIRCHILD SEMICONDUCTOR MMBT2907A 单晶体管 双极, 通用, PNP, 60 V, 200 MHz, 350 mW, 800 mA, 300 hFE
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MMBT2907A数据手册
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Date Created : 2007/11/30
Date Issued On : 2007/12/12
PCN# : Q4074815
FORECAST CHANGE NOTIFICATION
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence. This is a preliminary
notification. A Final PCN will be issued when qualification is complete and data is available.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
If you have any questions concerning this change, please contact:
Technical Contact:
Name: Yeoh, LiangChoon
E-mail: Liang.Yeoh@fairchildsemi.com
Phone:
PCN Originator:
Name: Ursal, Randy
E-mail: Randy.Ursal@notes.fairchildsemi.com
Phone:
Implementation of change:
Expected 1st Device Shipment Date: 2008/03/30
Earliest Year/Work Week of Changed Product: 0814
Change Type Description: Mold Compound
Description of Change (From): SOT23 and SC70 package assembly at all FSC approved
manufacturing locations (FSCP, CARSEM, HANA, UTL, AUK in Dalian, China, JCET,
FSPM) using non Green mold compound as shown in table 1:
Description of Change (To): SOT23 and SC70 package assembly at all FSC approved
manufacturing locations (FSCP, CARSEM, HANA, UTL, AUK in Dalian, China, JCET,
FSPM) using Green mold compound as shown in table 2:
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level
interconnect lead-free and RoHS compliance. The referenced material changes have been made
to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at:
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
affected products remain un-changed. Green products will be fully compliant to all published
data sheet specifications and will be interchangeable with current non-green product. Quality
and reliability will remain at the highest standards already demonstrated with Fairchild's
existing products.
Qual/REL Plan Numbers : Q20070464
Qualification :
Qualification of Green Mold compound for SOT23 and SC70 packages.
Pg. 1
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