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MMSZ5235BT1G
器件3D模型
0.109
导航目录
  • 封装尺寸在P3
  • 焊盘布局在P3
  • 型号编码规则在P1
  • 标记信息在P2
  • 焊接温度在P1
  • 功能描述在P4
  • 技术参数、封装参数在P1P4
  • 电气规格在P1P2
MMSZ5235BT1G数据手册
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of 4 Go
若手册格式错乱,请下载阅览PDF原文件
MMSZ5225 to MMSZ5267
www.vishay.com
Vishay Semiconductors
Rev. 1.9, 27-Feb-13
1
Document Number: 85774
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Small Signal Zener Diodes
FEATURES
Silicon planar Zener diodes
Standard Zener voltage tolerance is ± 5 % with
a “B” suffix (e.g.: MMSZ5225B), suffix “C” is
± 2 % tolerance
AEC-Q101 qualified
ESD capability according to AEC-Q101:
Human body model > 8 kV
Machine model > 800 V
Base P/N-E3 - RoHS-compliant, commercial grade
Base P/N-HE3 - RoHS-compliant, AEC-Q101 qualified
Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
PARAMETER VALUE UNIT
V
Z
range nom. 3.3 to 75 V
Test current I
ZT
1.7 to 20 mA
V
Z
specification Thermal equilibrium
Int. construction Single
ORDERING INFORMATION
DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITY
MMSZ5225 to
MMSZ5267
MMSZ5225B-E3-08 to MMSZ5267B-E3-08
3000 (8 mm tape on 7" reel) 15 000/box
MMSZ5225C-E3-08 to MMSZ5267C-E3-08
MMSZ5225B-HE3-08 to MMSZ5267B-HE3-08
MMSZ5225C-HE3-08 to MMSZ5267C-HE3-08
MMSZ5225B-E3-18 to MMSZ5267B-E3-18
10 000 (8 mm tape on 13" reel) 10 000/box
MMSZ5225C-E3-18 to MMSZ5267C-E3-18
MMSZ5225B-HE3-18 to MMSZ5267B-HE3-18
MMSZ5225C-HE3-18 to MMSZ5267C-HE3-18
PACKAGE
PACKAGE NAME WEIGHT
MOLDING COMPOUND
FLAMMABILITY RATING
MOISTURE SENSITIVITY
LEVEL
SOLDERING CONDITIONS
SOD-123 10.3 mg UL 94 V-0
MSL level 1
(according J-STD-020)
260 °C/10 s at terminals
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Power dissipation
T
L
= 75 °C, on FR - 4 or FR - 5 board with
minimum recommended solder pad layout
P
tot
500 mW
Zener current See table “Electrical Characteristics”
Thermal resistance junction to ambient air
On FR - 4 or FR - 5 board with minimum
recommended solder pad layout
R
thJA
340 K/W
Junction temperature
T
j
150
°CStorage temperature range
T
stg
- 65 to + 150
Operating temperature range
T
op
- 55 to + 150

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