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MP3H6115AC6U 数据手册 - NXP（恩智浦）
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NXP（恩智浦）
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压力传感器
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SSOP-8
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MP3H6115AC6U数据手册
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MP3H6115A
Sensors
Freescale Semiconductor, Inc. 5
3 On-chip Temperature Compensation and Calibration
Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A).
Figure 4 shows a typical application circuit (output source current operation).
Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for
operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm. The MP3H6115A pressure sensor operating characteristics, internal reliability and
qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3. Cross-sectional diagram (not to scale)
Figure 4. Recommended power supply decoupling and output filtering
Wire Bond
Stainless Steel
Cap
Thermoplastic
Case
Die Bond
Sealed
Vacuum Reference
Fluorosilicone
Gel Die Coat
Lead frame
Absolute Element
P1
Die
V
S
+3 V
GND
V
OUT
to ADC
100 nF
51 K
47 pF
GND
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