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器件3D模型￥ 28.223
MSP430F2252TDA 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
微控制器
封装:
TSSOP-38
描述:
TEXAS INSTRUMENTS MSP430F2252TDA 微控制器, 16位, 混合信号, MSP430F2xx, 16 MHz, 16 KB, 512 Byte, 38 引脚, TSSOP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P58P59P60P61P62P64P65P66P67P68P69P70Hot
典型应用电路图在P2
原理图在P7P58P59P60P61P62P63P65P66P67P68P69
封装尺寸在P2P6P80P81P82P83P85P86P87
标记信息在P80P81P82P83
封装信息在P2P80P81P82P83P84P85P86P87
技术参数、封装参数在P26P52P53
应用领域在P84P94
导航目录
MSP430F2252TDA数据手册
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2015
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
MSP430F2274TDAR ACTIVE TSSOP DA 38 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -40 to 105 M430F2274T
MSP430F2274TRHAR ACTIVE VQFN RHA 40 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 105 M430
F2274T
MSP430F2274TRHAT ACTIVE VQFN RHA 40 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 105 M430
F2274T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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