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MX25L6406EM2I-12G 数据手册 - Macronix International（旺宏电子）
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Macronix International（旺宏电子）
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Flash芯片
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NOR 闪存，标准串行接口，MX25xxx06 系列串行 NOR 闪存，标准串行接口，MX25xxx06 系列 Macronix MX25xxx06 系列提供标准串行接口单或双输入/输出。 电源为 3 V 或 2.5 V 单工作电压。 可在 4 KB 扇区和 64 KB 块上执行程序/擦除命令。### 闪存，Macronix
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MX25L6406EM2I-12G数据手册
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2
MX25L6406E
P/N: PM1577 REV. 1.9, OCT. 27, 2014
Contents
1. FEATURES .............................................................................................................................................................. 5
2. GENERAL DESCRIPTION ..................................................................................................................................... 6
3. PIN CONFIGURATIONS ......................................................................................................................................... 7
4. PIN DESCRIPTION .................................................................................................................................................. 7
5. BLOCK DIAGRAM ................................................................................................................................................... 8
6. MEMORY ORGANIZATION ..................................................................................................................................... 9
Table 1. Memory Organization
........................................................................................................................... 9
7. DEVICE OPERATION
............................................................................................................................................ 10
Figure 1. Serial Modes Supported.................................................................................................................... 10
8. DATA PROTECTION .............................................................................................................................................. 11
Table 2. Protected Area Sizes
.......................................................................................................................... 12
Table 3. 512 bit Secured OTP Denition .......................................................................................................... 12
9. HOLD FEATURES
................................................................................................................................................. 13
Figure 2. Hold Condition Operation
...................................................................................................... 13
10. COMMAND DESCRIPTION ................................................................................................................................. 14
Table 4. COMMAND DEFINITION
................................................................................................................... 14
10-1. Write Enable (WREN) ............................................................................................................................... 15
10-2. Write Disable (WRDI) ................................................................................................................................ 15
10-3. Read Status Register (RDSR) .................................................................................................................. 15
10-4. Write Status Register (WRSR) .................................................................................................................. 16
Table 5. Protection Modes ................................................................................................................................ 17
10-5. Read Data Bytes (READ) .......................................................................................................................... 18
10-6. Read Data Bytes at Higher Speed (FAST_READ) .................................................................................... 18
10-7. Dual Output Mode (DREAD) ..................................................................................................................... 18
10-8. Sector Erase (SE) ..................................................................................................................................... 18
10-9. Block Erase (BE) ....................................................................................................................................... 19
10-10. Chip Erase (CE) ...................................................................................................................................... 19
10-11. Page Program (PP) ................................................................................................................................. 19
10-12. Deep Power-down (DP) .......................................................................................................................... 20
10-13. Release from Deep Power-down (RDP), Read Electronic Signature (RES)
.......................................... 20
10-14. Read Identication (RDID) ...................................................................................................................... 21
10-15. Read Electronic Manufacturer ID & Device ID (REMS) .......................................................................... 21
Table 6. ID Denition ........................................................................................................................................ 22
10-16. Enter Secured OTP (ENSO) ................................................................................................................... 22
10-17. Exit Secured OTP (EXSO) ...................................................................................................................... 22
10-18. Read Security Register (RDSCUR) ........................................................................................................ 23
Table 7. Security Register Denition ................................................................................................................ 23
10-19. Write Security Register (WRSCUR) ........................................................................................................ 23
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