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NCP1034DR2G
器件3D模型
8.205
导航目录
  • 引脚图在P1
  • 典型应用电路图在P1P19P23
  • 原理图在P2
  • 封装尺寸在P24
  • 焊盘布局在P24
  • 型号编码规则在P1P23P24
  • 标记信息在P1P24
  • 封装信息在P23
  • 功能描述在P3
  • 技术参数、封装参数在P4P23
  • 应用领域在P1
  • 电气规格在P5P6
  • 型号编号列表在P4
NCP1034DR2G数据手册
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NCP1034
www.onsemi.com
24
PACKAGE DIMENSIONS
SOIC−16
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
16
89
8X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP1034/D
LITERATURE FULFILLMENT:
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NCP1034DR2 数据手册

ON Semiconductor(安森美)
ON SEMICONDUCTOR  NCP1034DR2G  控制器, PWM, 18V-10V电源, 500 kHz, SOIC-16 新
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