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器件3D模型￥ 1.021
NL7SZ19DFT2 数据手册 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
逻辑控制器
封装:
TSSOP-6
描述:
1至2解码器/多路解复用器 1−to−2 Decoder/Demultiplexer
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3D模型
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NL7SZ19DFT2数据手册
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of 6 Go
若手册格式错乱，请下载阅览PDF原文件
NL7SZ19
http://onsemi.com
6
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA-01
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
1
3
46
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42
6X
1.07
0.40
PITCH
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L1
DETAIL A
Bottom View
(Optional)
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2 0.40 0.50
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