Datasheet 搜索 > 运算放大器 > TI（德州仪器） > OPA2172IDR 数据手册 > OPA2172IDR 数据手册 2/50 页
器件3D模型￥ 5.856
OPA2172IDR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
SOIC-8
描述:
运算放大器 - 运放 36-V Sngle-Sup10-MHz RailtoRail OutputAmp
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P5P6Hot
典型应用电路图在P24P25
原理图在P18P28
封装尺寸在P31P33P34
标记信息在P31P32
封装信息在P30P31P32P33P34
技术参数、封装参数在P7P27
应用领域在P1P19P24P25P50
电气规格在P8P9
导航目录
OPA2172IDR数据手册
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OPA172
,
OPA2172
,
OPA4172
SBOS618H –DECEMBER 2013–REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
8.3 Feature Description................................................. 19
1 Features.................................................................. 1
8.4 Device Functional Modes........................................ 21
2 Applications ........................................................... 1
9 Applications and Implementation ...................... 24
3 Description............................................................. 1
9.1 Application Information............................................ 24
4 Revision History..................................................... 2
9.2 Typical Applications ................................................ 24
5 Device Comparison ............................................... 4
10 Power-Supply Recommendations..................... 27
6 Pin Configuration and Functions......................... 5
11 Layout................................................................... 28
7 Specifications......................................................... 7
11.1 Layout Guidelines ................................................. 28
7.1 Absolute Maximum Ratings ..................................... 7
11.2 Layout Example .................................................... 28
7.2 ESD Ratings.............................................................. 7
12 Device and Documentation Support................. 29
7.3 Recommended Operating Conditions....................... 7
12.1 Device Support...................................................... 29
7.4 Thermal Information: OPA172.................................. 7
12.2 Documentation Support ........................................ 29
7.5 Thermal Information: OPA2172................................ 8
12.3 Related Links ........................................................ 29
7.6 Thermal Information: OPA4172................................ 8
12.4 Community Resources.......................................... 29
7.7 Electrical Characteristics........................................... 8
12.5 Trademarks........................................................... 30
7.8 Typical Characteristics: Table of Graphs................ 10
12.6 Electrostatic Discharge Caution............................ 30
7.9 Typical Characteristics............................................ 11
12.7 Glossary................................................................ 30
8 Detailed Description............................................ 18
13 Mechanical, Packaging, and Orderable
8.1 Overview................................................................. 18
Information........................................................... 30
8.2 Functional Block Diagram....................................... 18
4 Revision History
Changes from Revision G (June 2015) to Revision H Page
• Added DRG package to OPA2172 device ............................................................................................................................ 1
• Added WSON to last Features bullet .................................................................................................................................... 1
• Added OPA2172 WSON row to Device Information table...................................................................................................... 1
• Added WSON-8 to OPA2172 row of Device Comparison table ............................................................................................ 4
• Added DRG pinout drawing ................................................................................................................................................... 5
• Added DRG column to OPA2172 and OPA4172 Pin Functions table .................................................................................. 6
• Added DRG column to OPA2172 Thermal Information table ................................................................................................ 8
Changes from Revision F (June 2015) to Revision G Page
• Added input bias current (I
B
) values for DGK and PW packages. ......................................................................................... 8
Changes from Revision E (December 2014) to Revision F Page
• Changed device status to Production Data from Mixed Status.............................................................................................. 1
• Changed OPA2172 DGK and OPA4172 PW packages to Production Data.......................................................................... 1
• Added OPA2172 VSSOP and OPA4172 TSSOP rows to Device Information table ............................................................. 1
• Deleted footnote from Device Comparison table.................................................................................................................... 4
• Deleted footnote from OPA2172 DGK and OPA4172 PW pin out drawings ........................................................................ 5
• Added OPA2172 DGK thermal information ........................................................................................................................... 8
2 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: OPA172 OPA2172 OPA4172
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