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器件3D模型￥ 91.334
OPA4350EA/2K5 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
放大器、缓冲器
封装:
SSOP-16
描述:
高速运算放大器 Hi-Spd Single-Sply Rail-to-Rail
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P18P19P20P21
原理图在P12P14P21P23
封装尺寸在P26P27P29P30
标记信息在P26P27P28
封装信息在P25P26P27P28P29P30
技术参数、封装参数在P4
应用领域在P1P18P19P20P21P40
电气规格在P6P7
导航目录
OPA4350EA/2K5数据手册
Page:
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若手册格式错乱，请下载阅览PDF原文件
OPA350
,
OPA2350
,
OPA4350
www.ti.com
SBOS099D –SEPTEMBER 2000–REVISED DECEMBER 2015
6.4 Thermal Information: OPA350 and OPA2350
OPA350, OPA2350
THERMAL METRIC
(1)
DGK (VSSOP) P (PDIP) D (SOIC) UNIT
8 PINS 8 PINS 8 PINS
R
θJA
Junction-to-ambient thermal resistance 169.2 53.1 140.1 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 62.8 42.5 89.8 °C/W
R
θJB
Junction-to-board thermal resistance 89.8 30.3 80.6 °C/W
ψ
JT
Junction-to-top characterization parameter 7.5 19.7 28.7 °C/W
ψ
JB
Junction-to-board characterization parameter 88.2 30.2 80.1 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Thermal Information: OPA4350
OPA4350
THERMAL METRIC
(1)
D (SOIC) DBQ (SSOP) UNIT
14 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 83.8 115.8 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 70.7 67 °C/W
R
θJB
Junction-to-board thermal resistance 59.5 58.3 °C/W
ψ
JT
Junction-to-top characterization parameter 11.6 19.9 °C/W
ψ
JB
Junction-to-board characterization parameter 37.7 57.9 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A N/A ° C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: OPA350 OPA2350 OPA4350
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