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OPA445BM 数据手册 - Burr Brown
制造商:
Burr Brown
分类:
运算放大器
封装:
TO-99-8
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P13
封装尺寸在P14P16P17
焊盘布局在P12
标记信息在P14P15
封装信息在P14P15P16P17
技术参数、封装参数在P3
应用领域在P1P8P11P13P25
电气规格在P3
导航目录
OPA445BM数据手册
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
OPA445ADDA ACTIVE SO PowerPAD DDA 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-2-260C-1 YEAR -55 to 125 OPA445
OPA445ADDAG4 ACTIVE SO PowerPAD DDA 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR -55 to 125 OPA445
OPA445ADDAR ACTIVE SO PowerPAD DDA 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-2-260C-1 YEAR -55 to 125 OPA445
OPA445AP ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type -55 to 125 OPA445AP
OPA445APG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type -55 to 125 OPA445AP
OPA445AU ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR OPA
445AU
OPA445AU/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -55 to 125 OPA
445AU
OPA445AUG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -55 to 125 OPA
445AU
OPA445BM ACTIVE TO-99 LMC 8 20 Green (RoHS
& no Sb/Br)
AU N / A for Pkg Type OPA445BM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
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