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PCA9306DQER 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
电压电平转换器
封装:
XFDFN-8
描述:
TEXAS INSTRUMENTS PCA9306DQER 专用接口, I2C, SMBus, 0 V, 5 V, X2SON, 8 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P11P12
原理图在P1P10P11
封装尺寸在P14P17P18P20P21
焊盘布局在P15
标记信息在P17P18
封装信息在P13P17P18P19P20P21
技术参数、封装参数在P4P11
应用领域在P1P19P38
电气规格在P6
型号编号列表在P11
导航目录
PCA9306DQER数据手册
Page:
of 38 Go
若手册格式错乱，请下载阅览PDF原文件
SN74LVC1G125
www.ti.com
SCES223T –APRIL 1999–REVISED OCTOBER 2014
7.3 Recommended Operating Conditions
(1)
MIN MAX UNIT
Operating 1.65 5.5
V
CC
Supply voltage V
Data retention only 1.5
V
CC
= 1.65 V to 1.95 V 0.65 × V
CC
V
CC
= 2.3 V to 2.7 V 1.7
V
IH
High-level input voltage V
V
CC
= 3 V to 3.6 V 2
V
CC
= 4.5 V to 5.5 V 0.7 × V
CC
V
CC
= 1.65 V to 1.95 V 0.35 × V
CC
V
CC
= 2.3 V to 2.7 V 0.7
V
IL
Low-level input voltage V
V
CC
= 3 V to 3.6 V 0.8
V
CC
= 4.5 V to 5.5 V 0.3 × V
CC
V
I
Input voltage 0 5.5 V
V
O
Output voltage 0 V
CC
V
V
CC
= 1.65 V –4
V
CC
= 2.3 V –8
I
OH
High-level output current –16 mA
V
CC
= 3 V
–24
V
CC
= 4.5 V –32
V
CC
= 1.65 V 4
V
CC
= 2.3 V 8
I
OL
Low-level output current 16 mA
V
CC
= 3 V
24
V
CC
= 4.5 V 32
V
CC
= 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
Δt/Δv Input transition rise or fall rate V
CC
= 3.3 V ± 0.3 V 10 ns/V
V
CC
= 5 V ± 0.5 V 5
T
A
Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7.4 Thermal Information
SN74LVC1G125
THERMAL METRIC
(1)
DBV DCK DRL DRY YZP DPW UNIT
5 PINS 5 PINS 5 PINS 6 PINS 5 PINS 4 PINS
R
θJA
Junction-to-ambient thermal resistance 229 278 243 439 130 340
R
θJC(top)
Junction-to-case (top) thermal resistance 164 93 78 277 54 215
R
θJB
Junction-to-board thermal resistance 62 65 78 271 51 294
°C/W
ψ
JT
Junction-to-top characterization parameter 44 2 10 84 1 41
ψ
JB
Junction-to-board characterization parameter 62 64 77 271 50 294
R
θJC(bot)
Junction-to-case (bottom) thermal resistance – – – – – 250
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 1999–2014, Texas Instruments Incorporated Submit Documentation Feedback 5
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