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器件3D模型￥ 6.131
PIC16F1823T-E/ST 数据手册 - Microchip（微芯）
制造商:
Microchip（微芯）
封装:
TSSOP
描述:
8月14日引脚闪存单片机采用nanoWatt XLP技术 8/14-Pin Flash Microcontrollers with nanoWatt XLP Technology
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P13P14P15P16P17P127P200P202P209P316Hot
典型应用电路图在P317
原理图在P12P20P55P66P75P99P127P131P133P149P154P160
封装尺寸在P373
标记信息在P371P372
封装信息在P371P382
功能描述在P307
技术参数、封装参数在P57P61P87P104P131P134P144P147P163P164P170P259
应用领域在P53P57P58P211P217
电气规格在P57P61P87P131P134P144P147P163P164P170P310
导航目录
PIC16F1823T-E/ST数据手册
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2010 Microchip Technology Inc. Preliminary DS41413A-page 317
PIC12F/LF1822/16F/LF1823
For additional interface recommendations, refer to your
specific device programmer manual prior to PCB
design.
It is recommended that isolation devices be used to
separate the programming pins from other circuitry.
The type of isolation is highly dependent on the specific
application and may include devices such as resistors,
diodes, or even jumpers. See Figure 27-4 for more
information.
FIGURE 27-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING
VDD
VPP
VSS
External
Device to be
Data
Clock
VDD
MCLR/VPP
VSS
ICSPDAT
ICSPCLK
*
*
*
To Normal Connections
*
Isolation devices (as required).
Programming
Signals
Programmed
VDD
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