Datasheet 搜索 > 32位控制器 > Microchip（微芯） > PIC32MX470F512L-I/PF 数据手册 > PIC32MX470F512L-I/PF 数据手册 1/344 页
器件3D模型￥ 69.381
PIC32MX470F512L-I/PF 数据手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
32位控制器
封装:
TQFP-100
描述:
PIC32MX330/350/370/430/450/470 32 位微控制器### PIC32 微控制器高性能的 32 位微控制器设计用于：高冲击强度图形/用户接口、以太网/USB/CAN 连接、多任务处理嵌入式控制、高性能音频
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4P5P6P7P8P9P12P28P170P277P278Hot
典型应用电路图在P31
原理图在P17P33P99P103P121P131P169P179P183P184P187P191
封装尺寸在P323
标记信息在P321P322
封装信息在P272P321P324P326P328P329P330P331P342
功能描述在P37
技术参数、封装参数在P246P247P248P273P277P278P279P280P283P284P286P304
电气规格在P28P232P246P247P248P281P313P336
导航目录
PIC32MX470F512L-I/PF数据手册
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若手册格式错乱，请下载阅览PDF原文件
2012-2013 Microchip Technology Inc. DS60001185C-page 1
PIC32MX330/350/370/430/450/470
Operating Conditions
• 2.3V to 3.6V, -40ºC to +105ºC (DC to 80 MHz),
-40ºC to +85ºC (DC to 100 MHz)
Core: 100 MHz/131 DMIPS MIPS32
®
M4K
®
•MIPS16e
®
mode for up to 40% smaller code size
• Code-efficient (C and Assembly) architecture
• Single-cycle (MAC) 32x16 and two-cycle 32x32 multiply
Clock Management
• 0.9% internal oscillator
• Programmable PLLs and oscillator clock sources
• Fail-Safe Clock Monitor (FSCM)
• Independent Watchdog Timer
• Fast wake-up and start-up
Power Management
• Low-power management modes (Sleep and Idle)
• Integrated Power-on Reset, Brown-out Reset, and High
Voltage Detect
• 0.5 mA/MHz dynamic current (typical)
•50 μA IPD current (typical)
Audio/Graphics/Touch HMI Features
• External graphics interface with up to 34 PMP pins
• Audio data communication: I
2
S, LJ, RJ, USB
• Audio data control interface: SPI and I
2
C™
• Audio data master clock:
- Generation of fractional clock frequencies
- Can be synchronized with USB clock
- Can be tuned in run-time
• Charge Time Measurement Unit (CTMU):
- Supports mTouch™ capacitive touch sensing
- Provides high-resolution time measurement (1 ns)
Advanced Analog Features
• ADC Module:
- 10-bit 1 Msps rate with one Sample and Hold (S&H)
- Up to 28 analog inputs
- Can operate during Sleep mode
• Flexible and independent ADC trigger sources
• On-chip temperature measurement capability
• Comparators:
- Two dual-input Comparator modules
- Programmable references with 32 voltage points
Timers/Output Compare/Input Capture
• Five General Purpose Timers:
- Five 16-bit and up to two 32-bit Timers/Counters
• Five Output Compare (OC) modules
• Five Input Capture (IC) modules
• Peripheral Pin Select (PPS) to allow function remap
• Real-Time Clock and Calendar (RTCC) module
Communication Interfaces
• USB 2.0-compliant Full-speed OTG controller
• Up to five UART modules (20 Mbps):
- LIN 1.2 protocols and IrDA
®
support
• Two 4-wire SPI modules (25 Mbps)
•Two I
2
C modules (up to 1 Mbaud) with SMBus support
• PPS to allow function remap
• Parallel Master Port (PMP)
Direct Memory Access (DMA)
• Four channels of hardware DMA with automatic data
size detection
• 32-bit Programmable Cyclic Redundancy Check (CRC)
• Two additional channels dedicated to USB
Input/Output
• 15 mA or 12 mA source/sink for standard VOH/VOL and
up to 22 mA for non-standard V
OH
1
• 5V-tolerant pins
• Selectable open drain, pull-ups, and pull-downs
• External interrupts on all I/O pins
Qualification and Class B Support
• AEC-Q100 REVG (Grade 2 -40ºC to +105ºC) planned
• Class B Safety Library, IEC 60730
Debugger Development Support
• In-circuit and in-application programming
• 4-wire MIPS
®
Enhanced JTAG interface
• Unlimited program and six complex data breakpoints
• IEEE 1149.2-compatible (JTAG) boundary scan
Packages
Type QFN TQFP VTLA
Pin Count 64 64 100 100 124
I/O Pins (up to) 53 53 85 85 85
Contact/Lead Pitch 0.50 0.50 0.40 0.50 0.50
Dimensions 9x9x0.9 10x10x1 12x12x1 14x14x1 9x9x0.9
Note: All dimensions are in millimeters (mm) unless specified.
32-bit Microcontrollers (up to 512 KB Flash and 128 KB SRAM)
with Audio/Graphics/Touch (HMI), USB, and Advanced Analog
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