Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC32MX575F256H-80I/PT 数据手册 > PIC32MX575F256H-80I/PT 数据手册 4/240 页
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PIC32MX575F256H-80I/PT 数据手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
TQFP-64
描述:
MICROCHIP PIC32MX575F256H-80I/PT 微控制器, 32位, 人机接口, PIC32, 80 MHz, 256 KB, 64 KB, 64 引脚, TQFP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4P5P6P7P8P9P10P11P12P13P14P24Hot
原理图在P23P39P107P115P117P121P123P125P126P127P129P131
封装尺寸在P221
标记信息在P219P220
封装信息在P4P178P219P223P224P225P230P231P235P239
功能描述在P45P137
技术参数、封装参数在P178P182P183P184P185P186P188P207P208P209P217P235
电气规格在P36P122P163P217P235
导航目录
PIC32MX575F256H-80I/PT数据手册
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PIC32MX5XX/6XX/7XX
DS61156B-page 4 Preliminary 2009 Microchip Technology Inc.
TABLE 1: PIC32MX FEATURES
Device
Pins
Program Memory (KB)
Data Memory (KB)
USB
Ethernet
CAN
Timers/Capture/Compare
DMA Channels
(Programmable/
Dedicated)
UART
(2,3)
SPI
(3)
I
2
C™
(3)
10-bit 1 Msps ADC
(Channels)
Comparators
PMP/PSP
JTAG
Trace
Packages
(4)
PIC32MX575F256H 64 256 + 12
(1)
64 1 0 1 5/5/5 8/4 6 3 4 16 2 Yes Yes No
PT,
MR
PIC32MX575F512H 64 512 + 12
(1)
64 1 0 1 5/5/5 8/4 6 3 4 16 2 Yes Yes No
PT,
MR
PIC32MX675F512H 64 512 + 12
(1)
64 1 1 0 5/5/5 8/4 6 3 4 16 2 Yes Yes No
PT,
MR
PIC32MX695F512H 64 512 + 12
(1)
128 1 1 0 5/5/5 8/4 6 3 4 16 2 Yes Yes No
PT,
MR
PIC32MX795F512H 64 512 + 12
(1)
128 1 1 2 5/5/5 8/8 6 3 4 16 2 Yes Yes No
PT,
MR
PIC32MX575F256L 100 256 + 12
(1)
64 1 0 1 5/5/5 8/4 6 4 5 16 2 Yes Yes Yes
PT,
PF,
BG
PIC32MX575F512L 100 512 + 12
(1)
64 1 0 1 5/5/5 8/4 6 4 5 16 2 Yes Yes Yes
PT,
PF,
BG
PIC32MX675F512L 100 512 + 12
(1)
64 1 1 0 5/5/5 8/4 6 4 5 16 2 Yes Yes Yes
PT,
PF,
BG
PIC32MX695F512L 100
512 + 12
(1)
128 1 1 0 5/5/5 8/4 6 4 5 16 2 Yes Yes Yes
PT,
PF,
BG
PIC32MX795F512L 100 512 + 12
(1)
128 1 1 2 5/5/5 8/8 6 4 5 16 2 Yes Yes Yes
PT,
PF,
BG
Legend: PF, PT = TQFP MR = QFN BG = XBGA
Note 1: This device features 12 KB boot Flash memory.
2: CTS and RTS pins may not be available for all UART modules. Refer to the “Pin Diagrams” section for more
information.
3: Some pins between the UART, SPI, and I
2
C modules may be shared. Refer to the “Pin Diagrams” section for more
information.
4: Refer to Section 32.0 “Packaging Information” for detailed information.
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