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器件3D模型￥ 34.671
PN5180A0ET/C1,118 数据手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
封装:
TFBGA-64
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P7P8P40Hot
原理图在P7P63
封装尺寸在P101P102
型号编码规则在P4
标记信息在P5P6
封装信息在P97P98P99P100
焊接温度在P103P104
功能描述在P1P2P9P63
技术参数、封装参数在P123
应用领域在P3P123
导航目录
PN5180A0ET/C1,118数据手册
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PN5180 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved.
Preliminary data sheet
COMPANY PUBLIC
Rev. 2.2 — 17 December 2015
240922 4 of 126
NXP Semiconductors
PN5180
High-power NFC frontend solution
5. Quick reference data
6. Ordering information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
V
DD(VBAT)
VBAT supply voltage - 2.7 3.3 5.5 V
V
DD(PVDD)
PVDD supply voltage 1.8 V supply 1.65 1.8 1.95 V
3.3 V supply 2.7 3.3 3.6 V
V
DD(TVDD)
TVDD supply voltage - 2.7 5.0 5.5 V
I
pd
power-down current VDD(TVDD) = VDD(PVDD)
=VDD(VDD) 3.0 V; hard
power-down; pin NRSTPD
set LOW, T
amb
= 25 °C
-10-A
I
stb
standby current T
amb
= 25 °C - 15 - A
I
DD(TVDD)
TVDD supply current - - 180 250 mA
T
amb
ambient temperature in still air with exposed pins
soldered on a 4 layer
JEDEC PCB
30 +25 +85 °C
T
stg
storage temperature no supply voltage applied 55 +25 +150 °C
Table 2. Ordering information
Type number Package
Name Description Version
PN5180A0HN/C1, 551 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads;
32 terminals + 1 central ground; body 6 x 6 x 1.0 mm; delivered
in one tray, bakable, MSL=3.
SOT618-1
PN5180A0HN/C1, 518 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads;
32 terminals + 1 central ground; body 6 x 6 x 1.0 mm; delivered
on reel MSL = 3.
SOT618-1
PN5180A0ET/C1, 151 TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls, delivered
in one tray, MSL = 1.
SOT1336-1
PN5180A0ET/C1, 118 TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls, delivered
on reel, MSL = 1.
SOT1336-1
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