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RC0201FR-07107RP 数据手册 - Yageo（国巨）
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贴片电阻
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RC0201FR-07107RP数据手册
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若手册格式错乱，请下载阅览PDF原文件
Chip Resistor Surface Mount
www.yageo.com
Aug. 22, 2014 V. 0
Product specification
6
8
SERIES
RC_P
0100 to 2512
TESTS AND REQUIREMENTS
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Temperature
Coefficient of
Resistance
(T.C.R.)
IEC 60115-1 4.8
At +25/–55 °C and +25/+125 °C
Refer to table 2
Formula:
T.C.R=
)tt(R
RR
121
12
× 10
6
(ppm/°C)
Where
t
1
=+25 °C or specified room temperature
t
2
=–55 °C or +125 °C test temperature
R
1
=resistance at reference temperature in ohms
R
2
=resistance at test temperature in ohms
Life/ Endurance
MIL-STD-202G Method 108A
IEC 60115-1 4.25.1
At 70± 5℃ for 1,000 hours; RCWV applied for
1.5 hours on and 0.5 hour off, still air required
± (1%+0.05Ω ) for D/F tol
± (3%+0.05Ω ) for J tol
<100mR for jumper
High
Temperature
Exposure
MIL-STD-202G Method 108A
IEC 60115-1 4.25.3
1,000 hours at maximum operating temperature
depending on specification, unpowered.
± (1%+0.05Ω ) for D/F tol
± (2%+0.05Ω ) for J tol
<50mR for jumper
Moisture
Resistance
MIL-STD-202G Method 106F
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
± (0.5%+0.05Ω ) for D/F tol
± (2%+0.05Ω ) for J tol
<100mR for jumper
Humidity
IEC 60115-1 4.37
Steady state for 1000 hours at 40 °C / 95% R.H.
RCWV applied for 1.5 hours on and
0.5 hour off
± (1%+0.05Ω ) for D/F tol
± (2%+0.05Ω ) for J tol
<100mR for jumper
Thermal
Shock
MIL-STD-202G Method 107G
-55/+125℃
Note Number of cycles required is 300 Devices
mounted
Maximum transfer time is 20 seconds Dwell time
is 15 minutes. Air - Air
± (0.5%+0.05Ω ) for D/F tol
± (1%+0.05Ω ) for J tol
<50mR for jumper
Short Time
Overload
IEC 60115-1 4.13
2.5 times RCWV or maximum overload voltage
which is less for 5 seconds at room temperature
± (1%+0.05Ω ) for D/F tol
± (2%+0.05Ω ) for J tol
<50mR for jumper
No visible damage
Board Flex/
Bending
IEC 60115-1 4.33
Device mounted or as described only 1 board
bending required
bending time: 60± 5 seconds
0100/0201/0402:5mm;
0603/0805:3mm;
1206 and above:2mm
± (1%+0.05Ω ) for D/F/J Tol
<50mR for jumper
No visible damage
Table 8 Test condition, procedure and requirements
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