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RFD3055LESM9A 数据手册 - Fairchild（飞兆/仙童）

制造商:

Fairchild（飞兆/仙童）

分类:

MOS管

封装:

TO-252-3

描述:

FAIRCHILD SEMICONDUCTOR RFD3055LESM9A 晶体管, MOSFET, N沟道, 11 A, 60 V, 0.107 ohm, 5 V, 3 V

Pictures:

3D模型

符号图

焊盘图

引脚图

产品图

页面导航:

封装信息在P1P2

应用领域在P1P2

导航目录

封装信息在P1 P2
应用领域在P1 P2

RFD3055LESM9A数据手册

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Chem-Wik

Rosin

The fast, safe rosin flux desoldering braid for

removing solder from leads and components

■

Coated with ultra high purity rosin

■

Quickly and thoroughly removes solder

■

Noncorrosive Type R rosin flux

Chem-Wik

Rosin Gray .030"/0.8mm 2-25L 2-50L 2-100L 2-500L Micro-Circuits

Yellow .050"/1.3mm 5-25L 5-50L 5-100L 5-500L Small Pads

Green .075"/1.9mm 7-25L 7-50L 7-100L 7-500L Medium Pads

Blue .100"/2.5mm 10-25L 10-50L 10-100L 10-500L Large Pads

Chem-Wik

Rosin SD Gray .030"/0.8mm 2-5L Micro-Circuits

Yellow .050"/1.3mm 5-5L Small Pads

Green .075"/1.9mm 7-5L Medium Pads

Blue .100"/2.5mm 10-5L Large Pads

Chem-Wik

Rosin SD

The fast,safe rosin flux desoldering braid

packaged in static dissipative bobbins

■

Reduces the risk of damage associated with

static electricity

■

Coated with noncorrosive ultra high purity Type

R rosin flux

■

Quickly and thoroughly removes solder

Chem-Wik

Desoldering Braid

As the standard desoldering braid for service and repair, Chem-Wik

Desoldering Braid ensures fast and safe desoldering.

The ultra-pure, oxygen free copper braid quickly and completely removes solder from circuit boards and components. Its fast

wicking action protects components from harmful heat damage. PermaPak

™

Barrier Packaging ensures ultimate braid

freshness and speed by sealing out harmful effects of the environment and protecting against oxidation.

PermaPak

™

Barrier Packaging

contains 25 bobbins per package

The Leader in

DDeessoollddeerriinngg TTeecchhnnoollooggyy

Chem-Wik

Desoldering Braid

Desoldering Applications

Cleaning Applications

Braid Sizes

Wire Wrap Pins

Desolder pins for easy removal. Removes solder buildup. Eliminates

potential intermittent problems.

Lugs/Posts

Wicks solder completely,

eliminating solder splash or

drip. Leaves terminal fluxed

and ready for resoldering.

Components

Easily removes solder from

components with straight or

clinched leads. Minimum

heat required. No damage

to board or components.

SMT Pads

Quickly and safely desolders

entire rows of SMT pads.

Applications-specific sizes

desolder individual fine-pitch

SMT pads.

BGA Pads

Safely removes solder from

BGA pads and chips in three

to four passes. Completely

removes all residual solder

and facilitates chip

repositioning.

Solder Bridges

Completely removes solder

bridges. Eliminates potential

shorts. No damage to

boards or circuitry.

Clean Script

Selectively retouches etched

script. Improves aesthetic

appearance. Eliminates

secondary identification.

Easy to use.

Blobs

Eliminates and removes

blobs as well as shorts and

icicles. Leaves circuitry

smooth. Cleans potential

problem areas.

Finger Connectors

Cleans finger connectors

and surface mount pads.

BGA Purple

.030”/0.8mm White

.060/”1.5mm Yellow

.080”/2.0mm Green

.110”/2.8mm Blue

.145”/3.7mm Brown

.210”/5.3mm Red

Chem-Wik

Desoldering Braid:

Meets or exceeds the greatest range of perfomance standards:

■

MIL-F-14256F Type R

■

NASA STD-8739.3 Soldered Electrical Connections

■

ANSI/IPC J STD-004, Type ROL0

Static Dissipative Packaging:

■

DOD Standard 1686C and MIL-HDBK-263B

■

Mil-Std-2000A

■

Mil-B-81705C Static Decay Rate Provision

Chem-Wik

Product Selection Guide

5' 25' 50' 100' 500'

PRODUCT COLOR SIZE 1.5m 7.5m 15.0m 30.5m 152.5m APPLICATION

Distributed by:

Soder-Wick

, Chem-Wik

and Chemtronics

are registered trademarks of ITW Chemtronics

VacuPak

™

,Performance Pak

™

and PermaPak

™

are trademarks of ITW Chemtronics

ITW Chemtronics

8125 Cobb Center Drive

Kennesaw, GA 30152-4386

770-424-4888 • 1-800-645-5244

Fax: 770-423-0748 • 1-800-243-6003

www.chemtronics.com

￥ 3.116

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