Datasheet 搜索 > Flash芯片 > Spansion（飞索半导体） > S29GL064N90TFI020 数据手册 > S29GL064N90TFI020 数据手册 1/83 页
器件3D模型￥ 7.35
S29GL064N90TFI020 数据手册 - Spansion（飞索半导体）
制造商:
Spansion（飞索半导体）
分类:
Flash芯片
封装:
TSOP-56
描述:
SPANSION S29GL064N90TFI020 闪存, 32 MB, 8M x 8位 / 4M x 16位, CFI, TSOP, 56 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P10Hot
原理图在P5
封装尺寸在P75P81
型号编码规则在P1P3P13P15P37P81
封装信息在P13P15
功能描述在P3
技术参数、封装参数在P1P60P63
电气规格在P2
型号编号列表在P1
导航目录
S29GL064N90TFI020数据手册
Page:
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若手册格式错乱，请下载阅览PDF原文件
"Spansion, Inc." and "Cypress Semiconductor Corp." have merged together to deliver high-performance, high-quality solutions
at the heart of today's most advanced embedded systems, from automotive, industrial and networking platforms to highly
interactive consumer and mobile devices. The new company "Cypress Semiconductor Corp." will continue to offer "Spansion,
Inc." products to new and existing customers.
Continuity of Specifications
There is no change to this document as a result of offering the device as a Cypress product. Any changes that have been made
are the result of normal document improvements and are noted in the document history page, where supported. Future
revisions will occur when appropriate, and changes will be noted in a document history page.
Continuity of Ordering Part Numbers
Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed
in this document.
For More Information
Please contact your local sales office for additional information about Cypress products and solutions.
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