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S8025R 数据手册 - Littelfuse（力特）
制造商:
Littelfuse（力特）
分类:
SCR晶闸管
封装:
TO-220-3
描述:
LITTELFUSE S8025R. 晶闸管, SCR, 25A, 800V, TO-220 非隔离型
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P1P2P3P4P5P6P7P8P9P10P11P12
焊盘布局在P2
型号编码规则在P13
功能描述在P1
导航目录
S8025R数据手册
Page:
of 20 Go
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Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
G Normally stocked
30
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D
2
PAK, TO-220, SOT-223, SOL-20
Height Above Footprint Thermal Performance at Typical Load
Standard PC Board Dimensions Package Package Natural Forced
P/N in. (mm) in. (mm) Format Quantity Convection Convection)
217-36CT6 G .390 (9.9) .600 (15.2) x .740 (18.8) Bulk 1 55°C @ 1W 16.0°C/W @ 200 LFM
217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) Tube 20 55°C @ 1W 16.0°C/W @ 200 LFM
217-36CTR6G .390 (9.9) .600 (15.2) x .740 (18.8) Tape & Reel 250 55°C @ 1W 16.0°C/W @ 200 LFM
Material: Copper, Tin, Lead Plated
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with tin-lead plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
REEL DETAILS
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
SECTION A-A
TAPE DETAILS
217-36CT6
217 HEAT SINK WITH
DDPAK DEVICE
KEY: L Device only, NC R Device + HS, NC G Device + HS, 100 lfm l Device + HS, 200 lfm r Device + HS, 300 lfm
MECHANICAL DIMENSIONS
Device Power Dissipation. W
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
Dimensions: in.
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