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SG150
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SG150数据手册
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©2011 Littelfuse, Inc.
Gas Discharge Tube (GDT) Products
65
Revised: September 26, 2011
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.
SG Series
SG Series
Device Dimensions
4.5 +/- 0.3
2.7 +/- 0.3
0.5 +/- 0.1
5.2
2.8
3.2 +/- 0.3
Recommended Soldering Pad Layout
4
Dimensions in Millimeters.
Reflow Condition 1Co'SFFBTTFNCMZ
Pre Heat
- Temperature Min (T
s(min)
) ¡$
- Temperature Max (T
s(max)
) ¡$
- Time (Min to Max) (t
s
) 60 – 180 secs
Average ramp up rate (Liquidus Temp
(T
L
) to peak
¡$TFDPOENBY
T
S(max)
to T
L
- Ramp-up Rate ¡$TFDPOENBY
Reflow
- Temperature (T
L
) (Liquidus) ¡$
- Temperature (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260
+0/-5
¡$
Time within 5°C of actual peak
Temperature (t
p
)
10 – 30 seconds
Ramp-down Rate ¡$TFDPOENBY
Time 25°C to peak Temperature (T
P
) NJOVUFT.BY
Do not exceed ¡$
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Time
Temperature
T
P
T
L
T
S(max)
T
S(min)
25
t
P
t
L
t
S
time to peak temperature
(t 25ºC to peak)
Ramp-down
Ramp-up
Preheat
Critical Zone
T
L
to T
P
Tape Dimenstions 5BQFTJ[FJTBDDPSEJOHUP*&$
8
3
1.5
3.65
4.9
12
Part Numbering System and Ordering Information
SG xxx Q
Breakdown Voltage
75 = 75V
90 = 90V
150 = 150V
230 = 230V
300 = 300V
350 = 350V
400 = 400V
420 = 420V
Series
Square GDT
Device Option Code
(Blank) = Standard device
Q = Quick Response Version
(300V, 350V and 420V only)
Packaging
Part Number and Device Type
Quantity and Packaging
Description
SGxxx Surface mount 2000pcs/reel in tape and reel
Downloaded from Elcodis.com electronic components distributor

SG150 数据手册

Littelfuse(力特)
3 页 / 0.2 MByte
Littelfuse(力特)
3 页 / 0.41 MByte
Littelfuse(力特)
2 页 / 0.18 MByte
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