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SG2524
,
SG3524
SLVS077E APRIL 1977REVISED JANUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage
(2)(3)
40 V
I
CC
Collector output current 100 mA
I
O(ref)
Reference output current 50 mA
Current through CT terminal –5 mA
T
J
Maximum junction temperature 150 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings table may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions table are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values are with respect to network ground terminal.
(3) The reference regulator may be bypassed for operation from a fixed 5-V supply by connecting the VCC and reference output (REF
OUT) pin both to the supply voltage. In this configuration, the maximum supply voltage is 6 V.
7.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
1000
pins
(1)
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-
1000
C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply Voltage 8 40 V
Reference output current 0 50 mA
Current through CT terminal –0.03 –2 mA
R
T
Timing resistor 1.8 100 kΩ
C
T
Timing capacitor 0.001 0.1 µF
SG2524 –25 85
T
A
Operating free-air temperature °C
SG3524 0 70
7.4 Thermal Information
SGx524
THERMAL METRIC
(1)
D N NS UNIT
16 PINS
R
θJA
Junction-to-ambient thermal resistance
(2)(3)
73 67 64 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Maximum power dissipation is a function of T
J
(max), θJA, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) TA)/θJA. Operation at the absolute maximum TJ of 150°C can impact reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
4 Submit Documentation Feedback Copyright © 1977–2015, Texas Instruments Incorporated
Product Folder Links: SG2524 SG3524

SG3524N 数据手册

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