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SL-108-G-19 数据手册 - Samtec（申泰电子）
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Samtec（申泰电子）
分类:
板对板连接器
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SL-108-G-19数据手册
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(2.54 mm) .100"
SL, SDL SERIES
SL–120–G–10
SDL–115–G–19
SL–110–TT–11
SDL–125–TT–12
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
Note: Some lengths,
styles and options are
non-standard, non-returnable.
1
NO. PINS
PER ROW
SL
= Single Row Low Profile Socket Strip
SDL
= Double Row Low Profile Socket Strip
TYPE
STRIP
Micro
Socket
Standard
Socket
(Reference only.
Not available
with SL & SDL)
Mates with:
TS, TD, HTS, BBS, BBD,
BBL, BDL, BHS
Low Insertion Force (LIF) Available
PLATING
OPTION
LEAD
STYLE
–G
= 30 µ" (0.76 µm)
Gold contact,
10 µ" (0.25 µm)
Gold shell
–T
= 30 µ" (0.76 µm)
Gold contact,
Tin shell
–TT
= Tin contact and shell
(LIF not available)
Contact Length =
(1.58 mm) .062"
Lead DIA Accepted =
(0.41 mm) .016" to (0.51 mm) .020"
Insertion Depth =
(1.65 mm) .065" to (3.81 mm) .150"
Style 12 Component Part No. =
SC-5P1
Contact Length =
(1.58 mm) .062"
Lead DIA Accepted =
(0.41 mm) .016" to (0.53 mm) .021"
Insertion Depth =
(2.03 mm) .080" to (2.67 mm) .105"
Style 11 Component Part No. =
SC-4P1
Style 31 Component Part No. =
EZ-4P1
Contact Length =
(2.11 mm) .083"
Lead DIA Accepted =
(0.38 mm) .015" to (0.51 mm) .020"
Insertion Depth =
(2.67 mm) .105" to (4.32 mm) .170"
Style 10 Component Part No. =
SC-3P1
Contact Length =
(1.58 mm) .062"
Lead DIA Accepted =
(0.41 mm) .016" to (0.51 mm) .020"
Insertion Depth =
(1.65 mm) .065" to (3.56 mm) .140"
Style 19 Component Part No. =
SC-8P1
Style 39 Component Part No. =
EZ-8P1
(4.45)
.175
(2.11)
.083
(0.25)
.010
(1.32)
.052
DIA
(0.74)
.029
DIA
(1.83)
.072 DIA
(4.19)
.165
(2.41)
.095
(0.51)
.020
(1.32)
.052
DIA
(0.76)
.030
DIA
(1.83)
.072 DIA
(4.83)
.190
(5.84)
.230
(1.83)
.072 DIA
(3.35)
.132
(0.51)
.020
(1.32)
.052
DIA
(1.32)
.052
DIA
(0.51)
.020
DIA
(0.76)
.030
DIA
(1.83)
.072 DIA
(6.10)
.240
(3.10)
.122
(0.76)
.030
• Achieve low profile
without sacrificing
insertion depth!
• Choice of four precision
screw machined lead
styles.
• Exceptionally low profile,
down to (2.11 mm) .083"
off of board.
• Mates with BBL or BDL
for board stacking
spaces down to
(3.89 mm) .153"
01
thru
36
01
thru
32
(2.54) .100 X No. of Positions
+ (0.23) .009
(2.54)
.100
(2.54)
.100
TYP
(5.08)
.200
(2.54)
.100
TYP
(1.27)
.050
(1.27)
.050
(2.54)
.100
(2.54) .100 X No. of Positions
+ (0.23) .009
F-217
For complete specifications
see www.samtec.com?SL or
www.samtec.com?SDL
Insulator Material:
Black Glass Filled Polyester
Contact/Shell Materials:
BeCu/Brass
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C with Gold
-55 °C to +105 °C with Tin
Contact Resistance:
10 mW
RoHS Compliant: Ye s
Lead-Free Solderable:
Wave only
Only .083” (2.11 mm)
above p.c. board
FEATURES
SPECIFICATIONS
LOW PROFILE MACHINED SOCKET STRIPS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
FILE NO. E111594
–19
= Micro-Socket
(Hollow Leg)
For LIF specify –39
–12
= Micro-Socket
(Hollow Leg)
–11
= Low Profile
(Standard Mount)
For LIF specify –31
–10
= Low Profile
(Hollow Leg)
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