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SMCJ36CA
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SMCJ36CA数据手册
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Transient Voltage Suppression Diodes
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
Surface Mount – 1500W > SMCJ series
TVS devices are ideal for the protection of I/O Interfaces,
V
CC
bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic
applications.
Applications
Features
The SMCJ series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Description
Parameter Symbol Value Unit
Peak Pulse Power Dissipation at
T
A
=25ºC by 10/1000µs Waveform
(Fig.2)(Note 1), (Note 2), (Note 5)
P
PPM
1500 W
Power Dissipation on Infinite Heat
Sink at T
L
=50
O
C
P
D
6.5 W
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
I
FSM
200 A
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only (Note 4)
V
F
3.5/5.0 V
Operating Temperature Range T
J
-65 to 150 °C
Storage Temperature Range T
STG
-65 to 175 °C
Typical Thermal Resistance Junction
to Lead
R
θJL
15
°C/W
Typical Thermal Resistance Junction
to Ambient
R
θJA
75
°C/W
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above T
J
(initial) =25
O
C per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
4. V
F
< 3.5V for single die parts and V
F
< 5.0V for stacked-die parts.
5. The P
PPM
of stacked-die parts is 2000W and please contact littelfuse for the detail
stacked-die parts.
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Agency Approvals
AGENCY AGENCY FILE NUMBER
E230531
• 1500W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
Excellent clamping
capability
Low incremental surge
resistance
Typical I
R
less than 1μA
when V
BR
min>12V
• For surface mounted
applications to optimize
board space
• Low profile package
• Built-in strain relief
Typical failure mode is
short from over-specified
voltage or current
Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
ESD protection of data
lines in accordance with
IEC 61000-4-2
EFT protection of data
lines in accordance with
IEC 61000-4-4
Fast response time:
typically less than 1.0ps
from 0V to BV min
• Glass passivated chip
junction
High temperature
to reflow soldering
guaranteed: 260°C/40sec
V
BR
@ T
J
= V
BR
@25°C
x (1+
αT x (T
J
- 25))
(
αT:Temperature
Coefficient, typical value
is 0.1%)
Plastic package is
flammability rated V-0 per
Underwriters Laboratories
Meet MSL level1, per
J-STD-020, LF maximun
peak of 260
°C
Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD-
609A.01)
SMCJ Series
Uni-directional
Bi-directional
Functional Diagram
Bi-directional
Uni-directional
Cathode
Anode
RoHS
Pb
e3
Datasheet
Additional Infomarion
Resources
Samples

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