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SN74AVC8T245RHLR 数据手册 - TI(德州仪器)
制造商:
TI(德州仪器)
分类:
逻辑控制器
封装:
VQFN-24
描述:
TEXAS INSTRUMENTS SN74AVC8T245RHLR. 芯片, 总线收发器, 非反相, QFN-24
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P1P14P15
原理图在P13P14
封装尺寸在P19P21P22
标记信息在P19P20
封装信息在P18P19P20P21P22
技术参数、封装参数在P4
应用领域在P1P29
电气规格在P6
导航目录
SN74AVC8T245RHLR数据手册
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SN74AVC8T245
www.ti.com
SCES517I –DECEMBER 2003–REVISED DECEMBER 2014
6.3 Recommended Operating Conditions
(1)(2)(3)
V
CCI
V
CCO
MIN MAX UNIT
V
CCA
Supply voltage 1.2 3.6 V
V
CCB
Supply voltage 1.2 3.6 V
1.2 V to 1.95 V V
CCI
× 0.65
High-level
V
IH
Data inputs 1.95 V to 2.7 V 1.6 V
input voltage
2.7 V to 3.6 V 2
1.2 V to 1.95 V V
CCI
× 0.35
Low-level
V
IL
Data inputs 1.95 V to 2.7 V 0.7 V
input voltage
2.7 V to 3.6 V 0.8
1.2 V to 1.95 V V
CCA
× 0.65
High-level DIR
V
IH
1.95 V to 2.7 V 1.6 V
input voltage (referenced to V
CCA
)
2.7 V to 3.6 V 2
1.2 V to 1.95 V V
CCA
× 0.35
Low-level DIR
V
IL
1.95 V to 2.7 V 0.7 V
input voltage (referenced to V
CCA
)
2.7 V to 3.6 V 0.8
V
I
Input voltage 0 3.6 V
Active state 0 V
CCO
V
O
Output voltage V
3-state 0 3.6
1.2 V –3
1.4 V to 1.6 V –6
I
OH
High-level output current 1.65 V to 1.95 V –8 mA
2.3 V to 2.7 V –9
3 V to 3.6 V –12
1.2 V 3
1.4 V to 1.6 V 6
I
OL
Low-level output current 1.65 V to 1.95 V 8 mA
2.3 V to 2.7 V 9
3 V to 3.6 V 12
Δt/Δv Input transition rise or fall rate 5 ns/V
T
A
Operating free-air temperature –40 85 °C
(1) V
CCI
is the V
CC
associated with the input port.
(2) V
CCO
is the V
CC
associated with the output port.
(3) All unused data inputs of the device must be held at V
CCI
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6.4 Thermal Information
SN74AVC8T245
THERMAL METRIC
(1)
DGV PW RHL UNIT
24 PINS 24 PINS 24 PINS
R
θJA
Junction-to-ambient thermal resistance 95.5 92.0 35.0
R
θJC(top)
Junction-to-case (top) thermal resistance 27.0 29.3 39.9
R
θJB
Junction-to-board thermal resistance 48.9 46.7 13.8
°C/W
ψ
JT
Junction-to-top characterization parameter 0.7 1.5 0.3
ψ
JB
Junction-to-board characterization parameter 48.5 46.2 13.8
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A N/A 1.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2003–2014, Texas Instruments Incorporated Submit Documentation Feedback 5
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