Datasheet 搜索 > TI（德州仪器） > SN74LVC1G07QDCKRQ1 数据手册 > SN74LVC1G07QDCKRQ1 数据手册 7/15 页
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SN74LVC1G07QDCKRQ1 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
SC-70-5
描述:
缓冲器和线路驱动器 Automotive Catalog Single Buffer/Driver With Open-Drain Output 5-SC70 -40 to 125
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SN74LVC1G07QDCKRQ1数据手册
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PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN74LVC1G02DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DCKT ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DRLR ACTIVE SOT DRL 5 4000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC1G02YZPR ACTIVE DSBGA YZP 5 3000 Green (RoHS &
no Sb/Br)
SNAGCU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2008
Addendum-Page 1
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