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SN74LVC1G32DCKR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
逻辑芯片
封装:
SC-70-5
描述:
TEXAS INSTRUMENTS SN74LVC1G32DCKR 或门, LVC系列, 1门, 2输入, 32 mA, 1.65V至5.5V, SC-70-5
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SN74LVC1G32DCKR数据手册
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SN74LVC1G32
www.ti.com
SCES219V –APRIL 1999–REVISED AUGUST 2015
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Operating 1.65 5.5
V
CC
Supply voltage V
Data retention only 1.5
V
CC
= 1.65 V to 1.95 V 0.65 × V
CC
V
CC
= 2.3 V to 2.7 V 1.7
V
IH
High-level input voltage V
V
CC
= 3 V to 3.6 V 2
V
CC
= 4.5 V to 5.5 V 0.7 × V
CC
V
CC
= 1.65 V to 1.95 V 0.35 × V
CC
V
CC
= 2.3 V to 2.7 V 0.7
V
IL
Low-level input voltage V
V
CC
= 3 V to 3.6 V 0.8
V
CC
= 4.5 V to 5.5 V 0.3 × V
CC
V
I
Input voltage 0 5.5 V
V
O
Output voltage 0 V
CC
V
V
CC
= 1.65 V –4
V
CC
= 2.3 V –8
I
OH
High-level output current –16 mA
V
CC
= 3 V
–24
V
CC
= 4.5 V –32
V
CC
= 1.65 V 4
V
CC
= 2.3 V 8
I
OL
Low-level output current 16 mA
V
CC
= 3 V
24
V
CC
= 4.5 V 32
V
CC
= 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
Δt/Δv Input transition rise or fall rate V
CC
= 3.3 V ± 0.3 V 10 ns/V
V
CC
= 5 V ± 0.5 V 5
T
A
Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6.4 Thermal Information
SN74LVC1G32
THERMAL METRIC
(1)
DBV DCK DRL DRY YZP DPW UNIT
5 PINS 5 PINS 5 PINS 6 PINS 5 PINS 4 PINS
R
θJA
Junction-to-ambient thermal resistance 229 278 243 439 130 340
R
θJCtop
Junction-to-case (top) thermal resistance 164 93 78 277 54 215
R
θJB
Junction-to-board thermal resistance 62 65 78 271 51 294
°C/W
ψ
JT
Junction-to-top characterization parameter 44 2 10 84 1 41
ψ
JB
Junction-to-board characterization parameter 62 64 77 271 50 294
R
θJCbot
Junction-to-case (bottom) thermal resistance – – – – – 250
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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