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SN74LVC2G04MDCKREP 数据手册 - TI(德州仪器)
制造商:
TI(德州仪器)
分类:
逻辑芯片
封装:
SC-70-6
描述:
TEXAS INSTRUMENTS SN74LVC2G04MDCKREP 非门, LVC系列, 1输入, 1.65V至5.5V, SC-70-6
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SN74LVC2G04MDCKREP数据手册
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www.ti.com
FEATURES
3
2
4
61
1A 1Y
2Y
GND
2A
DBV PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
61
1A 1Y
2Y
GND
2A
3
2
4
61
1A 1Y
2Y
GND
2A
1A
2A
1Y
2Y
GND
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
1
4
2
3
6
V
CC
V
CC
V
CC
5
V
CC
5
5
5
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G04-EP
DUAL INVERTER GATE
SGLS365 – AUGUST 2006
• Controlled Baseline • I
off
Supports Partial Power-Down-Mode
Operation
– One Assembly Site
• Latch-Up Performance Exceeds 100 mA Per
– One Test Site
JESD 78, Class II
– One Fabrication Site
• ESD Protection Exceeds JESD 22
• Extended Temperature Performance of –55 ° C
– 2000-V Human-Body Model (A114-A)
to 125 ° C
– 200-V Machine Model (A115-A)
• Enhanced Diminishing Manufacturing
Sources (DMS) Support – 1000-V Charged-Device Model (C101)
• Enhanced Product-Change Notification
(1)
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
• Qualification Pedigree
(1)
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
• Available in the Texas Instruments
temperature cycle, autoclave or unbiased HAST,
NanoStar™ and NanoFree™ Packages
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
• Supports 5-V V
CC
Operation
justifying use of this component beyond specified
• Inputs Accept Voltages to 5.5 V
performance and environmental limits.
• Max t
pd
of 4.1 ns at 3.3 V
• Low Power Consumption, 10- µ A Max I
CC
• ± 24-mA Output Drive at 3.3 V
• Typical V
OLP
(Output Ground Bounce) <0.8 V
at V
CC
= 3.3 V, T
A
= 25 ° C
• Typical V
OHV
(Output V
OH
Undershoot) >2 V at
V
CC
= 3.3 V, T
A
= 25 ° C
This dual inverter is designed for 1.65-V to 5.5-V V
CC
operation. The SN74LVC2G04 performs the Boolean
function Y = A.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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