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器件3D模型￥ 1.252
SN74LVC2G125DCTR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
逻辑控制器
封装:
SSOP-8
描述:
TEXAS INSTRUMENTS SN74LVC2G125DCTR. 芯片, 缓冲门 非反相, SSOP-8, 整卷
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P10P11
原理图在P1P9P10
封装尺寸在P13P15P16
标记信息在P13P14
封装信息在P12P13P14P15P16
技术参数、封装参数在P4P10
应用领域在P1P22
电气规格在P6
型号编号列表在P10
导航目录
SN74LVC2G125DCTR数据手册
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
74LVC2G125DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C25
Z
74LVC2G125DCTRE6 ACTIVE SM8 DCT 8 3000 Pb-Free
(RoHS)
CU SNBI Level-1-260C-UNLIM -40 to 125 C25
Z
74LVC2G125DCTRG4 ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C25
Z
74LVC2G125DCURE4 ACTIVE VSSOP DCU 8 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C25R
74LVC2G125DCURG4 ACTIVE VSSOP DCU 8 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C25R
74LVC2G125DCUTE4 ACTIVE VSSOP DCU 8 TBD Call TI Call TI -40 to 125
74LVC2G125DCUTG4 ACTIVE VSSOP DCU 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C25R
SN74LVC2G125DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C25
Z
SN74LVC2G125DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (25 ~ C25Q ~ C25R)
CZ
SN74LVC2G125DCUT ACTIVE VSSOP DCU 8 250 Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C25Q ~ C25R)
SN74LVC2G125YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM -40 to 125 (CM2 ~ CM7 ~ CMN)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
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