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SN74LVC2G34DBVT 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
逻辑控制器
封装:
SOT-23-6
描述:
74LVC2G 系列，Texas Instruments### 74LVC 系列
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SN74LVC2G34DBVT数据手册
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LVC2G34DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C345 ~ C34F ~
C34K ~ C34O ~
C34R)
SN74LVC2G34DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C34F
SN74LVC2G34DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C34F
SN74LVC2G34DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C345 ~ C34F ~
C34K ~ C34R)
SN74LVC2G34DBVTG4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 C34F
SN74LVC2G34DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C95 ~ C9F ~ C9K ~
C9R)
SN74LVC2G34DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C95 ~ C9F ~ C9K ~
C9R)
SN74LVC2G34DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C95 ~ C9F ~ C9K ~
C9R)
SN74LVC2G34DRLR ACTIVE SOT DRL 6 4000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 125 (C97 ~ C9R)
SN74LVC2G34YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM -40 to 85 (C92 ~ C97 ~ C9N)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
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