Datasheet 搜索 > IGBT晶体管 > ST Microelectronics（意法半导体） > STGW39NC60VD 数据手册 > STGW39NC60VD 数据手册 12/15 页
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STGW39NC60VD 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
IGBT晶体管
封装:
TO-247-3
描述:
STMICROELECTRONICS STGW39NC60VD 单晶体管, IGBT, 80 A, 2.5 V, 250 W, 600 V, TO-247, 3 引脚
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STGW39NC60VD数据手册
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Package mechanical data STGW39NC60VD
12/15
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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