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STM32F103VEH7 数据手册 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
微控制器
封装:
BGA-100
描述:
STMICROELECTRONICS STM32F103VEH7 微控制器, 32位, 电机控制, ARM 皮质-M3, 72 MHz, 512 KB, 64 KB, 100 引脚, BGA
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P25P26P27P28P29P30P31P32P33P34P35P36Hot
典型应用电路图在P60P62P110
封装尺寸在P115P116P117P118P119P120P121P122P123P124P125P126
型号编码规则在P134P135P136
技术参数、封装参数在P22P43P88
电气规格在P41P42P43P44P45P46P47P48P49P50P51P52
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STM32F103VEH7数据手册
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DocID14611 Rev 12 117/144
STM32F103xC, STM32F103xD, STM32F103xE Package information
136
Device marking for LFBGA144 package
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Figure 64. LFBGA144 marking example (package top view)
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
Dsm
0.470 mm typ. (depends on the solder mask
registration tolerance)
Stencil opening 0.400 mm
Stencil thickness Between 0.100 mm to 0.125 mm
Pad trace width 0.120 mm
Ball Diameter 0.400 mm
Table 66. LFBGA144 recommended PCB design rules (0.8 mm pitch BGA) (continued)
Dimension Recommended values
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