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STM32F407IGH6J 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
UFBGA-176
描述:
ARM Cortex-M4 168MHz 闪存：1MB RAM：192KB
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P41P42P43P44P45P46P47P48P49P50P51P52Hot
典型应用电路图在P102P103P136
封装尺寸在P164P165P166P167P168P169P170P171P172P173P174P175
型号编码规则在P185
技术参数、封装参数在P78P112
电气规格在P76P77P78P79P80P81P82P83P84P85P86P87
导航目录
STM32F407IGH6J数据手册
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Package information STM32F405xx, STM32F407xx
166/202 DocID022152 Rev 8
Device marking for WLCSP90
The following figure gives an example of topside marking and ball A1 position identifier
location.
Other optional marking or inset/upset marks, which depend on supply chain operations, are
not indicated below.
Figure 77. WLCSP90 marking example (package top view)
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
Table 91. WLCSP90 recommended PCB design rules
Dimension Recommended values
Pitch 0.4 mm
Dpad
260 µm max. (circular)
220 µm recommended
Dsm 300 µm min. (for 260 µm diameter pad)
PCB pad design Non-solder mask defined via underbump allowed
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