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STM32F417IGT7 数据手册 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
微控制器
封装:
LQFP-176
描述:
STMICROELECTRONICS STM32F417IGT7 微控制器, 32位, 以太网MAC, 照相机接口, ARM 皮质-M4, 168 MHz, 1 MB, 192 KB, 176 引脚, LQFP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P43P44P45P46P47P48P49P50P51P52P53P54Hot
典型应用电路图在P105P106P139
封装尺寸在P167P168P169P170P171P172P173P174P175P176P177P178
型号编码规则在P188
技术参数、封装参数在P80P115
电气规格在P78P79P80P81P82P83P84P85P86P87P88P89
导航目录
STM32F417IGT7数据手册
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DocID022063 Rev 7 169/205
STM32F415xx, STM32F417xx Package information
Device marking for WLCSP90
The following figure gives an example of topside marking and ball A1 position identifier
location.
Figure 77. WLCSP90 marking example (package top view)
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
Table 91. WLCSP90 recommended PCB design rules
Dimension Recommended values
Pitch 0.4 mm
Dpad
260 µm max. (circular)
220 µm recommended
Dsm 300 µm min. (for 260 µm diameter pad)
PCB pad design Non-solder mask defined via underbump allowed
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