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器件3D模型￥ 21.406
STM32F427VGT6 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-100
描述:
STMICROELECTRONICS STM32F427VGT6 微控制器, 32位, 高性能, ARM 皮质-M4, 180 MHz, 1 MB, 256 KB, 100 引脚, LQFP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P43P44P45P46P47P48P49P50P51P52P53P54Hot
典型应用电路图在P119P120P158
封装尺寸在P194P195P196P197P198P199P200P201P202P203P204P205
型号编码规则在P221
技术参数、封装参数在P91P131
电气规格在P89P90P91P92P93P94P95P96P97P98P99P100
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STM32F427VGT6数据手册
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DocID024030 Rev 8 199/233
STM32F427xx STM32F429xx Package information
227
Device marking for WLCSP143
The following figure gives an example of topside marking orientation versus ball A 1
identifier location.
Figure 85. WLCSP143 marking example (package top view)
1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
Samples to run qualification activity.
Table 112. WLCSP143 recommended PCB design rules (0.4 mm pitch)
Dimension Recommended values
Pitch 0.4
Dpad
260 µm max. (circular)
220 µm recommended
Dsm 300 µm min. (for 260 µm diameter pad)
PCB pad design Non-solder mask defined via underbump allowed.
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