Datasheet 搜索 > 32位控制器 > ST Microelectronics（意法半导体） > STM32L051T8Y6TR 数据手册 > STM32L051T8Y6TR 数据手册 105/127 页
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STM32L051T8Y6TR 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
32位控制器
封装:
WLCSP-36
描述:
STMICROELECTRONICS STM32L051T8Y6TR 微控制器, 32位, 超低功率, ARM 皮质-M0+, 32 MHz, 64 KB, 8 KB, 36 引脚, WLCSP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P33P34P35P36P37P38P39P40P41P42P43P44Hot
典型应用电路图在P71P90
封装尺寸在P101P102P103P104P105P106P107P108P109P110P111P112
型号编码规则在P54P121
技术参数、封装参数在P49
电气规格在P47P48P49P50P51P52P53P54P55P56P57P58
导航目录
STM32L051T8Y6TR数据手册
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DocID025938 Rev 6 105/127
STM32L051x6 STM32L051x8 Package information
121
Figure 41. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
,grid array recommended footprint
Note: Non solder mask defined (NSMD) pads are recommended.
4 to 6 mils solder paste screen printing process.
e - 0.500 - - 0.0197 -
F - 0.750 - - 0.0295 -
ddd - - 0.080 - - 0.0031
eee - - 0.150 - - 0.0059
fff - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 76. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA)
Dimension Recommended values
Pitch 0.5
Dpad 0.27 mm
Dsm
0.35 mm typ. (depends on the soldermask
registration tolerance)
Solder paste 0.27 mm aperture diameter.
Table 75. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
grid array package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
069
'VP
'SDG
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