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器件3D模型￥ 5.438
STM8S103F3P6TR 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
TSSOP-20
描述:
基本型8位MCU
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P81P84
原理图在P11
封装尺寸在P88P89P90P91P92P93P94P95P96P97P98P99
型号编码规则在P105P106P108P109
封装信息在P106
功能描述在P12P13P14P15P16P17P18P19P20
技术参数、封装参数在P51P86
电气规格在P25P50P51P52P53P54P55P56P57P58P59P60
导航目录
STM8S103F3P6TR数据手册
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DocID15441 Rev 12 97/118
STM8S103F2 STM8S103F3 STM8S103K3 Package information
105
Device marking
The following figure gives an example of topside marking orientation versus pin 1 identifier
location.
Figure 54. SDIP32 marking example (package top view)
1. Parts marked as “ES”,”E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
eB - - 12.700 - - 0.5000
L 2.540 3.048 3.810 0.1000 0.1200 0.1500
1. Values in inches are converted from mm and rounded to 4 decimal digits
Table 55. SDIP32 package mechanical data (continued)
Dim.
mm inches
(1)
Min Typ Max Min Typ Max
069
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