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TAS5142DKDR 数据手册 - TI(德州仪器)
制造商:
TI(德州仪器)
分类:
音频放大器
封装:
SSOP-36
描述:
立体声数字放大器功率级 STEREO DIGITAL AMPLIFIER POWER STAGE
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P6P7
封装尺寸在P23P25P26P28
焊盘布局在P29
型号编码规则在P4
标记信息在P23
封装信息在P23P24P25P26
技术参数、封装参数在P4P8P9P10
应用领域在P1P22P34
电气规格在P10P20P21P22
导航目录
TAS5142DKDR数据手册
Page:
of 34 Go
若手册格式错乱,请下载阅览PDF原文件

PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TAS5142DDV ACTIVE HTSSOP DDV 44 35 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 70 TAS5142
TAS5142DDVR ACTIVE HTSSOP DDV 44 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 70 TAS5142
TAS5142DDVRG4 ACTIVE HTSSOP DDV 44 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR 0 to 70 TAS5142
TAS5142DKD ACTIVE HSSOP DKD 36 29 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-4-260C-72 HR 0 to 70 TAS5142
TAS5142DKDR ACTIVE HSSOP DKD 36 500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-4-260C-72 HR 0 to 70 TAS5142
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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