Web Analytics
Datasheet 搜索 > ST Microelectronics(意法半导体) > TDA8172 数据手册 > TDA8172 数据手册 5/8 页
TDA8172
3.863
导航目录
  • 引脚图在P1
  • 原理图在P1
  • 封装尺寸在P6
  • 技术参数、封装参数在P2P7
  • 电气规格在P2
TDA8172数据手册
Page:
of 8 Go
若手册格式错乱,请下载阅览PDF原文件
Obsolete Product(s) - Obsolete Product(s) Obsolete Product(s) - Obsolete Product(s)
TDA8172
5/7
4 MOUNTING INSTRUCTIONS
The power dissipated in the circuit is removed by adding an external heatsink. With the HEPTAWATT
package, the heatsink is simply attached with a screw or a compression spring (clip).
A layer of silicon grease inserted between heatsink and package optimizes thermal contact ; no electrical
isolation is needed between the two surfaces since the tab is connected to Pin 4 which is ground.
Figure 6. Mounting examples

TDA8172 数据手册

ST Microelectronics(意法半导体)
8 页 / 0.26 MByte
器件 Datasheet 文档搜索
器件加载中...
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册,每天更新 5,000 多个 PDF 文件