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TDA8359J
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TDA8359J数据手册
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2002 Jan 21 2
Philips Semiconductors Product specification
Full bridge vertical deflection output circuit
in LVDMOS
TDA8359J
FEATURES
Few external components required
High efficiency fully DC-coupled vertical bridge output
circuit
Vertical flyback switch with short rise and fall times
Built-in guard circuit
Thermal protection circuit
Improved EMC performance due to differential inputs.
GENERAL DESCRIPTION
The TDA8359J is a power circuit for use in 90° and 110°
colour deflection systems for 25 to 200 Hz field
frequencies, and for 4 : 3 and 16 : 9 picture tubes. The IC
contains a vertical deflection output circuit, operating as a
high efficiency class G system. The full bridge output
circuit allows DC coupling of the deflection coil in
combination with single positive supply voltages.
The IC is constructed in a Low Voltage DMOS (LVDMOS)
process that combines bipolar, CMOS and DMOS
devices. DMOS transistors are used in the output stage
because of absence of second breakdown.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
P
supply voltage 7.5 12 18 V
V
FB
flyback supply voltage 2 × V
P
45 66 V
I
q(P)(av)
average quiescent supply current during scan 10 15 mA
I
q(FB)(av)
average quiescent flyback supply current during scan −−10 mA
P
tot
total power dissipation −−10 W
Inputs and outputs
V
i(p-p)
input voltage (peak-to-peak value) 1000 1500 mV
I
o(p-p)
output current (peak-to-peak value) −−3.2 A
Flyback switch
I
o(peak)
maximum (peak) output current t 1.5 ms −−±1.8 A
Thermal data; in accordance with IEC 60747-1
T
stg
storage temperature 55 −+150 °C
T
amb
ambient temperature 25 −+85 °C
T
j
junction temperature −−150 °C
TYPE
NUMBER
PACKAGE
NAME DESCRIPTION VERSION
TDA8359J DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length
12/11 mm); exposed die pad
SOT523-1

TDA8359J 数据手册

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TDA8359 数据手册

Philips(飞利浦)
NXP(恩智浦)
NXP(恩智浦)
全桥垂直偏转输出电路LVDMOS Full bridge vertical deflection output circuit in LVDMOS
Philips(飞利浦)
NXP(恩智浦)
Trident Microsystems
Trident Microsystems
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