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TDA8932T 数据手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
音频放大器
封装:
SOIC-32
描述:
音频放大器 2X15W BTL CLASS D AMP+VOLCTRL
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TDA8932T数据手册
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TDA8932B_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 18 December 2008 2 of 48
NXP Semiconductors
TDA8932B
Class-D audio amplifier
4. Quick reference data
[1] Output power is measured indirectly; based on R
DSon
measurement.
[2] Two layer application board (55 mm × 45 mm), 35 µm copper, FR4 base material in free air with natural
convection.
5. Ordering information
Table 1. Quick reference data
V
P
= 22 V; f
osc
= 320 kHz; T
amb
=25
°
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Supplies
V
P
supply voltage asymmetrical supply 10 22 36 V
I
P
supply current Sleep mode - 145 195 µA
I
q(tot)
total quiescent
current
Operating mode; no load, no
snubbers and no filter
connected
- 4050mA
Stereo SE channel; R
s
< 0.1 Ω
[1]
P
o(RMS)
RMS output power continuous time output power
per channel;
THD+N = 10 %; f
i
= 1 kHz
R
L
=4Ω; V
P
= 22 V 13.8 15.3 - W
R
L
=8Ω; V
P
= 30 V 14.0 15.5 - W
short time output power per
channel; THD+N = 10 %;
f
i
= 1 kHz
[2]
R
L
=4Ω; V
P
= 29 V 23.8 26.5 - W
Mono BTL; R
s
< 0.1 Ω
[1]
P
o(RMS)
RMS output power continuous time output power;
THD+N = 10 %; f
i
= 1 kHz
R
L
=4Ω; V
P
= 12 V 15.5 17.2 - W
R
L
=8Ω; V
P
= 22 V 28.9 32.1 - W
short time output power;
THD+N = 10 %; f
i
= 1 kHz
[2]
R
L
=8Ω; V
P
= 29 V 49.5 55.0 - W
Table 2. Ordering information
Type number Package
Name Description Version
TDA8932BT SO32 plastic small outline package; 32 leads;
body width 7.5 mm
SOT287-1
TDA8932BTW HTSSOP32 plastic thermal enhanced thin shrink small outline
package; 32 leads; body width 6.1 mm; lead pitch
0.65 mm; exposed die pad
SOT549-1
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