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器件3D模型￥ 0.969
TL064CPWR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
TSSOP-14
描述:
TEXAS INSTRUMENTS TL064CPWR 运算放大器, 四路, 1 MHz, 4个放大器, 3.5 V/µs, 7V 至 36V, TSSOP, 14 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4Hot
典型应用电路图在P16P17
原理图在P1P14P16P20
封装尺寸在P22P23P24P25P26P27P30P31P32P44
焊盘布局在P45
标记信息在P22P23P24P25P26P27P28
封装信息在P21P22P23P24P25P26P27P28P29P30P31P32
技术参数、封装参数在P4P19
应用领域在P1P16P17P29P52
电气规格在P6P7P8
导航目录
TL064CPWR数据手册
Page:
of 52 Go
若手册格式错乱，请下载阅览PDF原文件
TL061
,
TL061A
,
TL061B
TL062
,
TL062A
,
TL062B
,
TL064
,
TL064A
,
TL064B
www.ti.com
SLOS078L –NOVEMBER 1978–REVISED MAY 2015
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
2000
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-
2000
C101
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC+
Supply voltage 5 15 V
V
CC–
Supply voltage –5 –15 V
V
CM
Common-mode voltage V
CC–
+ 4 V
CC+
– 4 V
TL06xM –55 125
TL06xQ –40 125
T
A
Ambient temperature °C
TL06xI –40 85
TL06xC 0 70
6.4 Thermal Information - 8 Pins
TL06xx
THERMAL METRIC
(1)
D (SOIC) P (PDIP) PS (SO) PW (TSSOP) JG (CDIP) UNIT
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS
R
θJ
Junction-to-ambient thermal
97 85 95 149 — °C/W
A
resistance
(2)(3)
R
θJ
Junction-to-case (top) thermal
C(to
— — — — 14.5 °C/W
resistance
(4)(5)
p)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Maximum power dissipation is a function of T
J(max)
, R
θJA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J(max)
– T
A
)/R
θJA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) Maximum power dissipation is a function of T
J(max)
, R
θJC
, and T
C
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J(max)
– T
C
) / R
θJC
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(5) The package thermal impedance is calculated in accordance with MIL-STD-883.
6.5 Thermal Information - 14 Pins
TL06xx
D (SOIC) N (PDIP) NS (SO) PS (SO) PW J (CDIP) W (CFP)
THERMAL METRIC
(1)
UNIT
(TSSOP)
14 PINS 14 PINS 14 PINS 8 PINS 14 PINS 14 PINS 14 PINS
R
θJ
Junction-to-ambient thermal 113
86 80 76 95 — — °C/W
A
resistance
(2)(3)
R
θJ
Junction-to-case (top) thermal
C(to
— — — — — 15.05 14.65 °C/W
resistance
(2)(3)
p)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Maximum power dissipation is a function of T
J(max)
, R
θJC
, and T
C
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J(max)
– T
C
) / R
θJC
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
(3) The package thermal impedance is calculated in accordance with MIL-STD-883.
Copyright © 1978–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
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