Datasheet 搜索 > 电压基准芯片 > TI（德州仪器） > TL4050A50IDBZRG4 数据手册 > TL4050A50IDBZRG4 数据手册 3/53 页
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TL4050A50IDBZRG4 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
电压基准芯片
封装:
SOT-23-3
描述:
精密微功耗并联型电压基准 PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P18
封装尺寸在P3P4P5P6P7P8P9P30P31P32P33P34
型号编码规则在P3P4P5P6P7P8P9
标记信息在P3P4P5P6P7P8P9
封装信息在P30P31P32P33P34P35P36P37P38P39P51
应用领域在P53
导航目录
TL4050A50IDBZRG4数据手册
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of 53 Go
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PREVIEW
SLVS543I − AUGUST 2004 − REVISED MAY 2005
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
V
ref
TOLERANCE (25°C) = 2%
TL431, TL432 ORDERING INFORMATION
T
A
PACKAGE
†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PDIP (P) Tube of 50 TL431CP TL431CP
SOIC (D)
Tube of 75 TL431CD
TL431C
SOIC (D)
Reel of 2500 TL431CDR
TL431C
SOP (PS) Reel of 2000 TL431CPSR T431
Reel of 3000 TL431CDBVR
T3C_
SOT-23-5 (DBV)
Reel of 250 TL431CDBVT
T3C_
SOT-23-5 (DBV)
Reel of 3000 TL432CDBVR
T4C_
Reel of 250 TL432CDBVT
T4C_
Reel of 3000 TL431CDBZR
T3C_
SOT-23-3 (DBZ)
Reel of 250 TL431CDBZT
T3C_
0
°
C to 70
°
C
SOT-23-3 (DBZ)
Reel of 3000 TL432CDBZR
T4C_
0 C to 70 C
Reel of 250 TL432CDBZT
T4C_
SOT-89 (PK)
Reel of 1000
TL431CPK 43
SOT-89 (PK) Reel of 1000
TL432CPK 2A
Bulk of 1000,
straight lead
TL431CLP
TO-226/TO-92 (LP)
Ammo of 2000,
formed lead
TL431CLPM
TL431C
Reel of 2000,
formed lead
TL431CLPR
TSSOP (PW)
Tube of 150 TL431CPW
T431
TSSOP (PW)
Reel of 2000 TL431CPWR
T431
PDIP (P) Tube of 50 TL431IP TL431IP
SOIC (D)
Tube of 75 TL431ID
TL431I
SOIC (D)
Reel of 2500 TL431IDR
TL431I
Reel of 3000 TL431IDBVR
T3I_
SOT-23-5 (DBV)
Reel of 250 TL431IDBVT
T3I_
SOT-23-5 (DBV)
Reel of 3000 TL432IDBVR
T4I_
Reel of 250 TL432IDBVT
T4I_
Reel of 3000 TL431IDBZR
T3I_
−40 C to 85 C
SOT-23-3 (DBZ)
Reel of 250 TL431IDBZT
T3I_
−40°C to 85°C
SOT-23-3 (DBZ)
Reel of 3000 TL432IDBZR
T4I_
Reel of 250 TL432IDBZT
T4I_
SOT-89 (PK)
Reel of 1000
TL431IPK 3I
SOT-89 (PK) Reel of 1000
TL432IPK 2B
Bulk of 1000,
straight lead
TL431ILP
TO-226/TO-92 (LP)
Ammo of 2000,
formed lead
TL431ILPM
TL431I
Reel of 2000,
formed lead
TL431ILPR
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
‡
DBV/DBZ: The actual top-side marking has one additional character that designates the assembly/test site.
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