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TLC59116 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
TSSOP-28
描述:
16 通道 Fm+ I2C 总线恒流下沉式 LED 驱动器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4P5Hot
典型应用电路图在P1P28P29
原理图在P12
封装尺寸在P33P35P36
标记信息在P33
封装信息在P32P33P34P35P36
技术参数、封装参数在P6
应用领域在P1P42
电气规格在P7
导航目录
TLC59116数据手册
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TLC59116
SLDS157E –FEBRUARY 2008–REVISED DECEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage 0 7 V
V
I
Input voltage –0.4 V
CC
+ 0.4 V
V
O
Output voltage –0.5 20 V
I
O
Output current per channel 120 mA
T
J
Junction temperature –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –55 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 1500
pins
(1)
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification 500
JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation
MIN MAX UNIT
V
CC
Supply voltage 3 5.5 V
V
IH
High-level input voltage SCL, SDA, RESET, A0, A1, A2, A3 0.7 × V
CC
V
CC
V
V
IL
Low-level input voltage SCL, SDA, RESET, A0, A1, A2, A3 0 0.3 × V
CC
V
V
O
Supply voltage to output pins OUT0 to OUT15 17 V
V
CC
= 3 V 20
I
OL
Low-level output current sink SDA mA
V
CC
= 5 V 30
I
O
Output current per channel OUT0 to OUT15 5 120 mA
T
A
Operating free-air temperature –40 85 °C
7.4 Thermal Information
TLC59116
THERMAL METRIC
(1)
PW RHB UNIT
28 PINS 32 PINS
R
θJA
Junction-to-ambient thermal resistance 78 34.3
R
θJC(top)
Junction-to-case (top) thermal resistance 18.8 26.3
R
θJB
Junction-to-board thermal resistance 36 8.3
°C/W
ψ
JT
Junction-to-top characterization parameter 0.5 0.4
ψ
JB
Junction-to-board characterization parameter 35.5 8.2
R
θJC(bot)
Junction-to-case (bottom) thermal resistance n/a 3.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated
Product Folder Links: TLC59116
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