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TLC5947 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
HTSSOP-32
描述:
24通道，12位PWM LED驱动器 24-Channel, 12-Bit PWM LED Driver with
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4Hot
典型应用电路图在P18
原理图在P11P12P20
封装尺寸在P23P25P26
标记信息在P23P24
封装信息在P22P23P24P25P26
技术参数、封装参数在P4
应用领域在P1P33
电气规格在P6
导航目录
TLC5947数据手册
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of 33 Go
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TLC5947
www.ti.com
SBVS114B –JULY 2008–REVISED JANUARY 2015
6.3 Recommended Operating Conditions
At T
A
= –40°C to 85° C, unless otherwise noted.
MIN NOM MAX UNIT
DC CHARACTERISTICS: V
CC
= 3 V to 5.5 V
V
CC
Supply voltage 3.0 5.5 V
V
O
Voltage applied to output OUT0 to OUT23 30 V
V
IH
High-level input voltage 0.7 × V
CC
V
CC
V
V
IL
Low-level input voltage GND 0.3 × V
CC
V
I
OH
High-level output current SOUT –3 mA
I
OL
Low-level output current SOUT 3 mA
I
OLC
Constant output sink current OUT0 to OUT23 2 30 mA
T
A
Operating free-air temperature range –40 85 °C
T
J
Operating junction temperature –40 125 °C
AC CHARACTERISTICS: V
CC
= 3 V to 5.5 V
SCLK, Standalone operation 30 MHz
f
SCLK
Data shift clock frequency
SCLK, Duty 50%, cascade operation 15 MHz
T
WH0
SCLK = High-level pulse width 12 ns
T
WL0
Pulse duration SCLK = Low-level pulse width 10 ns
T
WH1
XLAT, BLANK High-level pulse width 30 ns
T
SU0
SIN–SCLK↑ 5 ns
T
SU1
Setup time XLAT↑–SCLK↑ 100 ns
T
SU2
XLAT↑–BLANK↓ 30 ns
T
H0
SIN–SCLK↑ 3 ns
Hold time
T
H1
XLAT↑–SCLK↑ 10 ns
6.4 Thermal Information
TLC5947
THERMAL METRIC
(1)
DAP UNIT
32 PINS
R
θJA
Junction-to-ambient thermal resistance 32.8
R
θJC(top)
Junction-to-case (top) thermal resistance 17.1
R
θJB
Junction-to-board thermal resistance 17.9
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 17.8
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 1.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Dissipation Ratings
OPERATING FACTOR T
A
< 25°C T
A
= 70°C T
A
= 85°C
PACKAGE ABOVE T
A
= 25°C POWER RATING POWER RATING POWER RATING
HTSSOP-32 with
42.54 mW/°C 5318 mW 3403 mW 2765 mW
PowerPAD™ soldered
(1)
HTSSOP-32 with
22.56 mW/°C 2820 mW 1805 mW 1466 mW
PowerPAD not soldered
(2)
QFN-32
(3)
27.86 mW/°C 3482 mW 2228 mW 1811 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002.
(2) With PowerPAD not soldered onto copper area on PCB.
(3) The package thermal impedance is calculated in accordance with JESD51-5.
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