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TLC5973
ZHCSAX3B MARCH 2013REVISED MAY 2014
www.ti.com.cn
6.3 Recommended Operating Conditions
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
DC CHARACTERISTICS
No internal shunt regulator mode 3.0 5.0 5.5 V
V
CC
Supply voltage
Internal shunt regulator mode 6.0 V
V
O
Voltage applied to output OUT0 to OUT2 21 V
V
IH
High-level input voltage SDI 0.7 × V
CC
V
CC
V
V
IL
Low-level input voltage SDI GND 0.3 × V
CC
V
V
IHYST
Input voltage hysteresis SDI 0.2 × V
CC
V
I
OH
High-level output current SDO –2 mA
SDO 2 mA
I
OL
Low-level output current OUT0 to OUT2 (VCC 4.0 V) 2 35 mA
OUT0 to OUT2 (VCC > 4.0 V) 2 50 mA
I
REG
Shunt regulator sink current VCC 20 mA
T
A
Operating free-air temperature range –40 85 °C
T
J
Operating junction temperature range –40 125 °C
AC CHARACTERISTICS
f
CLK (SDI)
Data transfer rate SDI 100 3000 kHz
t
SDI
SDI input pulse duration SDI 60 0.5 / f
CLK
ns
t
WH
Pulse duration, high SDI 14 ns
t
WL
Pulse duration, low SDI 14 ns
t
H0
Hold time: end of sequence (EOS) SDI to SDI 3.5 / f
CLK
5.5 / f
CLK
ns
t
H1
Hold time: data latch (GSLAT) SDI to SDI 8 / f
CLK
ns
6.4 Thermal Information
TLC5973
THERMAL METRIC
(1)
D (SO) UNIT
8 PINS
R
θJA
Junction-to-ambient thermal resistance 134.6
R
θJC(top)
Junction-to-case (top) thermal resistance 88.6
R
θJB
Junction-to-board thermal resistance 75.3
°C/W
ψ
JT
Junction-to-top characterization parameter 37.7
ψ
JB
Junction-to-board characterization parameter 74.8
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Copyright © 2013–2014, Texas Instruments Incorporated

TLC5973 数据手册

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