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TLP521-4 数据手册 - ISOCOM Components（安数光）
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ISOCOM Components（安数光）
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光耦合器/光隔离器
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DIP
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DIP16 通孔 四通道 55 V 5300 Vrms 光电晶体管 光耦合器
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TLP521-4数据手册
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Spec. No. JENF243A-0004R-01 P.6/9
MURATA MFG.CO., LTD.
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
□Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C, 60s min.
Heating 250°C, 4s~6s 265°C±3°C, 5s max.
Cycle of flow 2 times 2 times
□Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C~180°C, 90s±30s
Heating above 220°C, 30s~60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
250℃
265℃±3℃
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
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