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TLV1117LV33DCYR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
TO-261-4
描述:
TEXAS INSTRUMENTS TLV1117LV33DCYR 固定电压稳压器, LDO, 2V至5.5V, 455mV压差, 3.3V输出, 1A输出, SOT-223-4
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页面导航:
引脚图在P3Hot
典型应用电路图在P1P13
原理图在P11
封装尺寸在P18P20P21
标记信息在P18P19
封装信息在P1P16P17P18P19P20P21
技术参数、封装参数在P4
应用领域在P1P24
电气规格在P5
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TLV1117LV33DCYR数据手册
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TLV1117LV
SBVS160B –MAY 2011–REVISED FEBRUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
At T
J
= 25°C (unless otherwise noted). All voltages are with respect to GND.
(1)
MIN MAX UNIT
V
IN
–0.3 6 V
Voltage
V
OUT
–0.3 6 V
Current I
OUT
Internally limited
Output short-circuit duration Indefinite
Continuous total power
P
DISS
See Thermal Information
dissipation
Operating junction, T
J
–55 150 °C
Temperature
Storage, T
stg
–55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
±2000
all pins
(1)
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification
±500
JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
IN
2 5.5 V
V
OUT
0 5.5 V
I
OUT
0 1 A
6.4 Thermal Information
TLV1117LV
THERMAL METRIC
(1)
DCY (SOT-223) UNIT
4 PINS
R
θJA
Junction-to-ambient thermal resistance 62.9
θ
JCtop
Junction-to-case (top) thermal resistance 47.2
R
θJC(top)
Junction-to-board thermal resistance 12 °C/W
ψ
JT
Junction-to-top characterization parameter 6.1
ψ
JB
Junction-to-board characterization parameter 11.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: TLV1117LV
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