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FEATURES DESCRIPTION
TLV2470 , , TLV2471
TLV2472 , TLV2473
TLV2474 , TLV2475 , TLV247xA
SLOS232E JUNE 1999 REVISED JULY 2007
FAMILY OF 600 μ A/Ch 2.8MHz RAIL-TO-RAIL INPUT/OUTPUT
HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN
CMOS Rail-To-Rail Input/Output
The TLV247x is a family of CMOS rail-to-rail input/
output operational amplifiers that establishes a new
Input Bias Current: 2.5pA
performance point for supply current versus ac
Low Supply Current: 600 μ A/Channel
performance. These devices consume just
Ultra-Low Power Shutdown Mode:
600 μ A/channel while offering 2.8MHz of
I
DD(SHDN)
: 350nA/ch at 3V
gain-bandwidth product. Along with increased ac
I
DD(SHDN)
: 1000nA/ch at 5V
performance, the amplifier provides high output drive
capability, solving a major shortcoming of older
Gain-Bandwidth Product: 2.8MHz
micropower operational amplifiers. The TLV247x can
High Output Drive Capability:
swing to within 180mV of each supply rail while
± 10mA at 180mV
driving a 10mA load. For non-RRO applications, the
TLV247x can supply ± 35mA at 500mV off the rail.
± 35mA at 500mV
Both the inputs and outputs swing rail-to-rail for
Input Offset Voltage: 250 μ V (typ)
increased dynamic range in low-voltage applications.
Supply Voltage Range: 2.7V to 6V
This performance makes the TLV247x family ideal
for sensor interface, portable medical equipment,
Ultra-Small Packaging
and other data acquisition circuits.
SOT23-5 or -6 (TLV2470/1)
MSOP-8 or -10 (TLV2472/3)
FAMILY PACKAGE TABLE
PACKAGE TYPES
NUMBER OF
DEVICE SHUTDOWN UNIVERSAL EVM BOARD
CHANNELS
PDIP SOIC SOT23 TSSOP MSOP
TLV2470 1 8 8 6 Yes
TLV2471 1 8 8 5
TLV2472 2 8 8 8
Refer to the EVM Selection
Guide (SLOU060 )
TLV2473 2 14 14 10 Yes
TLV2474 4 14 14 14
TLV2475 4 16 16 16 Yes
A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS
(1)
V
DD
V
IO
BW SLEW RATE I
DD
(per channel)
DEVICE OUTPUT DRIVE RAIL-TO-RAIL
(V) ( μ V) (MHz) (V/ μ s) ( μ A)
TLV247X 2.7 6.0 250 2.8 1.5 600 ± 35mA I/O
TLV245X 2.7 6.0 20 0.22 0.11 23 ± 10mA I/O
TLV246X 2.7 6.0 150 6.4 1.6 550 ± 90mA I/O
TLV277X 2.5 6.0 360 5.1 10.5 1000 ± 10mA O
(1) All specifications measured at 5V.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

TLV2472IDGN 数据手册

TI(德州仪器)
64 页 / 2.72 MByte

TLV2472 数据手册

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