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器件3D模型￥ 19.069
TLV2774ID 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
SOIC-14
描述:
TEXAS INSTRUMENTS TLV2774ID 运算放大器, 四路, 5.1 MHz, 4个放大器, 10.5 V/µs, 2.5V 至 6V, SOIC, 14 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P36
封装尺寸在P3P4P42P43P44P45P46P47P48P50P51P52
焊盘布局在P72
标记信息在P42P43P44P45P46P47P48P49
封装信息在P42P43P44P45P46P47P48P49P50P51P52
应用领域在P1P49P76
型号编号列表在P3
导航目录
TLV2774ID数据手册
Page:
of 76 Go
若手册格式错乱，请下载阅览PDF原文件
SLOS209G − JANUARY 1998 − REVISED FEBRUARY 2004
4
WWW.TI.COM
TLV277x PACKAGE PINOUTS
(1)
1
2
3
4
5
10
9
8
7
6
1OUT
1IN−
1IN+
GND
1SHDN
V
DD
2OUT
2IN−
2IN+
2SHD
N
3
2
4
5
(TOP VIEW)
1
OUT
GND
IN+
V
DD
IN−
TLV2771
DBV PACKAGE
TLV2773
DGS PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
V
DD
2OUT
2IN−
2IN+
TLV2772
D, DGK, JG, P, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
NC
IN−
IN+
GND
SHDN
V
DD
OUT
NC
TLV2770
D, DGK
†
OR P PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
NC
IN−
IN+
GND
NC
V
DD
OUT
NC
TLV2771
D PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
GND
NC
1SHDN
NC
V
DD
2OUT
2IN−
2IN+
NC
2SHDN
NC
(TOP VIEW)
TLV2773
D OR N PACKAGE
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
V
DD
2IN+
2IN−
2OUT
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
(TOP VIEW)
TLV2774
D, N, OR PW PACKAGE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1OUT
1IN−
1IN+
V
DD
2IN+
2IN−
2OUT
1/2SHDN
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
3/4SHD
N
(TOP VIEW)
TLV2775
D, N, OR PW PACKAGE
NC
V
DD
+
2OUT
2IN −
2IN +
NC
1OUT
1IN −
1IN +
GND
10
9
8
7
6
(TOP VIEW)
TLV2772M AND TLV2772AM
U PACKAGE
†
This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.
1
2
3
4
5
(1) SOT−23 may or may not be indicated
TYPICAL PIN 1 INDICATORS
Printed or
Molded Dot
Bevel Edges
Pin 1
Molded ”U” Shape
Pin 1
Stripe
Pin 1
Pin 1
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